AMD Xilinx
XC2S400E-6FG456I
XC2S400E-6FG456I ECAD Model
XC2S400E-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S400E-6FG456I Datasheet Download
XC2S400E-6FG456I Overview
The XC2S400E-6FG456I chip model is a powerful and versatile piece of technology that has been designed to meet the needs of a wide range of industries. It offers a range of advantages, including high speed, low power consumption, and flexibility. This makes it an ideal choice for applications in a variety of industries, from medical to automotive, and from consumer electronics to industrial automation.
The chip model is designed to be highly efficient, with a high-performance processor core and a range of features that make it suitable for a variety of applications. It has a wide range of features, including a high-speed bus interface, a high-speed memory controller, and a range of other features that make it suitable for a variety of applications. Additionally, it is designed to be highly reliable, with a robust power management system and a range of features that ensure it can be used in a variety of environments.
Looking forward, the demand for the XC2S400E-6FG456I chip model is likely to remain strong across a range of industries. This is due to its versatility, its ability to be used in a range of applications, and its low power consumption. Additionally, its high speed and flexibility make it suitable for a range of applications, from medical to automotive, and from consumer electronics to industrial automation.
The original design intention of the XC2S400E-6FG456I chip model was to provide a powerful and reliable platform for a variety of applications. It is designed to be highly efficient, with a high-performance processor core and a range of features that make it suitable for a variety of applications. Additionally, it is designed to be highly reliable, with a robust power management system and a range of features that ensure it can be used in a variety of environments.
The possibility of future upgrades to the XC2S400E-6FG456I chip model is strong, as the technology continues to develop. It is likely that the chip model will be able to take advantage of advances in hardware, software, and networking technology, allowing it to be used in a variety of advanced communication systems. Additionally, the chip model is likely to be able to take advantage of advances in artificial intelligence and machine learning, allowing it to be used in a variety of intelligent scenarios.
The XC2S400E-6FG456I chip model is likely to be able to be used in a variety of networks and intelligent scenarios in the future. It is likely to be able to be used in a variety of advanced communication systems, allowing it to be used in a variety of scenarios. Additionally, it is likely to be able to be used in a variety of intelligent scenarios, allowing it to be used in a variety of scenarios in the era of fully intelligent systems.
Overall, the XC2S400E-6FG456I chip model is a powerful and versatile piece of technology that has been designed to meet the needs of a wide range of industries. It is likely to remain in high demand in the future, as it is able to be used in a variety of applications, from medical to automotive, and from consumer electronics to industrial automation. Additionally, it is likely to be able to take advantage of advances in hardware, software, and networking technology, allowing it to be used in a variety of advanced communication systems. Finally, it is likely to be able to be used in a variety of networks and intelligent scenarios in the future, allowing it to be used in a variety of scenarios in the era of fully intelligent systems.
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5,051 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1.8994 | $1.8994 |
| 10+ | $1.8790 | $18.7901 |
| 100+ | $1.7769 | $177.6888 |
| 1000+ | $1.6748 | $837.3840 |
| 10000+ | $1.5318 | $1,531.8000 |
| The price is for reference only, please refer to the actual quotation! | ||