AMD Xilinx
XC2S400E-6FG456C
XC2S400E-6FG456C ECAD Model
XC2S400E-6FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 145000 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 145000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 400000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 456 | |
| ECCN Code | 3A991.D |
XC2S400E-6FG456C Datasheet Download
XC2S400E-6FG456C Overview
The chip model XC2S400E-6FG456C is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is built with advanced technology and is capable of handling complex tasks with ease. This chip model is designed to be used with the HDL language, which makes it an ideal choice for those who are looking for a reliable and efficient solution for their applications.
The XC2S400E-6FG456C chip model can be used in a variety of applications, ranging from network communication to intelligent scenarios. It can be used to develop and popularize future intelligent robots, as well as to facilitate the development of fully intelligent systems. The chip model is also capable of handling complex tasks with ease, which makes it a great choice for those who are looking for a reliable and efficient solution for their applications.
In order to use the XC2S400E-6FG456C chip model effectively, it is important to have the necessary technical skills. Knowledge of the HDL language is essential, as well as an understanding of the chip model’s capabilities and limitations. Additionally, it is important to have a good understanding of the applications that the chip model is intended for, in order to ensure that it is used in the most effective way possible.
Overall, the XC2S400E-6FG456C chip model is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is capable of handling complex tasks with ease. With the right technical skills, this chip model can be used to develop and popularize future intelligent robots, as well as to facilitate the development of fully intelligent systems.
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5,384 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $49.7178 | $49.7178 |
| 10+ | $49.1832 | $491.8320 |
| 100+ | $46.5102 | $4,651.0200 |
| 1000+ | $43.8372 | $21,918.6000 |
| 10000+ | $40.0950 | $40,095.0000 |
| The price is for reference only, please refer to the actual quotation! | ||