
AMD Xilinx
XC2S300E-7PQG208C
XC2S300E-7PQG208C ECAD Model
XC2S300E-7PQG208C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 329 | |
Number of Outputs | 329 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 93000 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 93000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 300000 | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LEAD FREE, PLASTIC, QFP-208 | |
Pin Count | 208 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2S300E-7PQG208C Datasheet Download
XC2S300E-7PQG208C Overview
The XC2S300E-7PQG208C chip model is a highly versatile and powerful device that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The XC2S300E-7PQG208C chip model is designed to provide flexibility and scalability, allowing users to upgrade their systems as needed.
The XC2S300E-7PQG208C chip model is designed to provide the necessary features and performance to meet the needs of the most demanding applications. It has a wide range of features, including high-speed I/O, high-performance memory, and high-performance microprocessors. It is also designed to be compatible with a variety of operating systems, including Windows, Linux, and Mac OS X.
The XC2S300E-7PQG208C chip model is designed to be compatible with advanced communication systems, such as Bluetooth and Wi-Fi, providing users with the ability to connect to multiple devices and networks. The chip model features a low-power design, allowing users to reduce their power consumption while still providing the performance they need.
The XC2S300E-7PQG208C chip model is designed to provide users with the flexibility to customize their systems to meet their specific needs. It includes a variety of design options, including memory, I/O, and microprocessor configurations. The chip model also includes a variety of tools and design aids, such as simulation tools, debugging tools, and design verification tools.
When designing systems with the XC2S300E-7PQG208C chip model, it is important to consider the specific design requirements and product specifications of the chip model. It is also important to consider actual case studies and best practices when designing systems with the chip model. Additionally, it is important to consider any potential issues or risks associated with the chip model, and to take appropriate precautions to ensure that the system is properly designed and implemented.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $62.8680 | $62.8680 |
10+ | $62.1920 | $621.9200 |
100+ | $58.8120 | $5,881.2000 |
1000+ | $55.4320 | $27,716.0000 |
10000+ | $50.7000 | $50,700.0000 |
The price is for reference only, please refer to the actual quotation! |