AMD Xilinx
XC2S300E-7PQ208C
XC2S300E-7PQ208C ECAD Model
XC2S300E-7PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 |
XC2S300E-7PQ208C Datasheet Download
XC2S300E-7PQ208C Overview
The XC2S300E-7PQ208C chip is a high-performance programmable logic device (PLD) designed by Xilinx. It is a powerful and versatile chip that is suitable for a wide range of digital signal processing, embedded processing, and image processing applications. The chip model is designed to be programmed using the HDL (Hardware Description Language) language, making it a great choice for developers who want to create complex and sophisticated applications.
The XC2S300E-7PQ208C chip is a great choice for any digital signal processing, embedded processing, or image processing application. Its versatility and power make it a great choice for developers who want to create complex and sophisticated applications. Its design also makes it an ideal choice for applications that require high-performance and low-power consumption.
When it comes to the industry trends of the XC2S300E-7PQ208C chip and the future development of related industries, the specific technologies and design requirements of the chip model will determine whether the application environment requires the support of new technologies. For example, if the application requires the use of advanced image processing algorithms, then the chip model must be able to support these algorithms. Similarly, if the application requires the use of high-speed data transfer protocols, then the chip model must be able to support these protocols.
In addition to industry trends, the product description and specific design requirements of the XC2S300E-7PQ208C chip should also be taken into consideration. This includes information about the chip’s features, capabilities, and limitations. It is also important to consider actual case studies and precautions when using the chip model. For example, if the application is going to be used in a high-temperature environment, then the chip model must be able to support the necessary temperature range.
Overall, the XC2S300E-7PQ208C chip is a powerful and versatile chip that is suitable for a wide range of digital signal processing, embedded processing, and image processing applications. It is designed to be programmed using the HDL language, making it a great choice for developers who want to create complex and sophisticated applications. The industry trends of the chip model and the future development of related industries will depend on the specific technologies and design requirements of the chip model. It is also important to consider the product description and specific design requirements of the chip model, as well as actual case studies and precautions when using the chip model.
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3,489 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $62.8680 | $62.8680 |
| 10+ | $62.1920 | $621.9200 |
| 100+ | $58.8120 | $5,881.2000 |
| 1000+ | $55.4320 | $27,716.0000 |
| 10000+ | $50.7000 | $50,700.0000 |
| The price is for reference only, please refer to the actual quotation! | ||