AMD Xilinx
XC2S300E-7FGG456C
XC2S300E-7FGG456C ECAD Model
XC2S300E-7FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S300E-7FGG456C Datasheet Download
XC2S300E-7FGG456C Overview
The chip model XC2S300E-7FGG456C is a FPGA (Field-Programmable Gate Array) chip produced by Xilinx, a leader in the semiconductor industry. This chip is designed to provide a high-performance, low-power solution for a variety of applications in the industrial, consumer, and communications markets. It has a wide range of features, including high-speed logic, high-speed memory, and high-speed I/O. It also offers a variety of advanced features, such as advanced clock management, power management, and security.
The XC2S300E-7FGG456C chip is designed to provide a high-performance, low-power solution for a variety of applications. It is a cost-effective solution for applications that require high-speed logic, high-speed memory, and high-speed I/O. It also provides advanced features, such as advanced clock management, power management, and security. This chip is designed to be used in applications such as communications, industrial automation, and consumer electronics.
The XC2S300E-7FGG456C chip is designed to be used in applications that require high-speed logic, high-speed memory, and high-speed I/O. It is also designed to be used in advanced communication systems that require advanced features, such as advanced clock management, power management, and security. The chip is designed to be used in applications such as communications, industrial automation, and consumer electronics.
The XC2S300E-7FGG456C chip is designed to provide a high-performance, low-power solution for a variety of applications. It offers a wide range of features, including high-speed logic, high-speed memory, and high-speed I/O. It also offers a variety of advanced features, such as advanced clock management, power management, and security. The chip is designed to be used in applications such as communications, industrial automation, and consumer electronics.
The XC2S300E-7FGG456C chip is expected to be in high demand in the future, as more applications require high-speed logic, high-speed memory, and high-speed I/O. It is also expected to be in high demand in advanced communication systems that require advanced features, such as advanced clock management, power management, and security. The chip is also expected to be in high demand in applications such as communications, industrial automation, and consumer electronics.
The original design intention of the XC2S300E-7FGG456C chip was to provide a high-performance, low-power solution for a variety of applications. It is designed to be used in applications that require high-speed logic, high-speed memory, and high-speed I/O. It is also designed to be used in advanced communication systems that require advanced features, such as advanced clock management, power management, and security.
The XC2S300E-7FGG456C chip is designed to be upgradeable in the future, as new technologies become available. This chip is designed to be used in applications such as communications, industrial automation, and consumer electronics. It is also designed to be used in advanced communication systems that require advanced features, such as advanced clock management, power management, and security.
In conclusion, the XC2S300E-7FGG456C chip is a high-performance, low-power solution for a variety of applications. It is designed to provide a wide range of features, including high-speed logic, high-speed memory, and high-speed I/O. It is also designed to be used in advanced communication systems that require advanced features, such as advanced clock management, power management, and security. The chip is expected to be in high demand in the future, as more applications require high-speed logic, high-speed memory, and high-speed I/O. It is also designed to be upgradeable in the future, as new technologies become available.
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