AMD Xilinx
XC2S300E-7FG456C
XC2S300E-7FG456C ECAD Model
XC2S300E-7FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S300E-7FG456C Datasheet Download
XC2S300E-7FG456C Overview
The chip model XC2S300E-7FG456C is a powerful integrated circuit that was designed to meet the needs of modern high-performance applications. It is a versatile, low-power, high-speed device that can be used in a wide range of applications, including communications, networking, and multimedia. This chip can be used to create powerful and sophisticated systems that can be used in the most demanding applications.
The XC2S300E-7FG456C chip is capable of meeting the performance requirements of advanced communication systems. It has the ability to support high-speed data transfer, as well as multiple protocol and modulation techniques. It is also designed to be compatible with various network architectures, allowing for easy integration into existing systems. Additionally, this chip is designed to be easily upgradeable, so it can be used in the future for more advanced applications.
The XC2S300E-7FG456C chip can be used in the development of advanced networks. It can be used to create powerful and sophisticated systems that can be used in the most demanding applications. This chip is also capable of being used in the development of intelligent systems, such as those used in the Internet of Things. Additionally, this chip can be used to create systems that are capable of providing advanced data analysis and machine learning capabilities.
The XC2S300E-7FG456C chip is capable of providing the necessary support for new technologies, such as 5G and Edge Computing. This chip can also be used in the development of fully autonomous systems, such as self-driving cars or robots. Additionally, this chip can be used in the development of intelligent systems, such as those used in the Internet of Things.
In conclusion, the XC2S300E-7FG456C chip is a powerful integrated circuit designed to meet the needs of modern high-performance applications. It is capable of meeting the performance requirements of advanced communication systems, and can be used in the development of advanced networks, intelligent systems, and fully autonomous systems. Additionally, this chip can provide the necessary support for new technologies, such as 5G and Edge Computing.
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|---|---|---|
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