XC2S300E-7FG256I
XC2S300E-7FG256I
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AMD Xilinx

XC2S300E-7FG256I


XC2S300E-7FG256I
F20-XC2S300E-7FG256I
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XC2S300E-7FG256I ECAD Model


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XC2S300E-7FG256I Attributes


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XC2S300E-7FG256I Overview



The XC2S300E-7FG256I chip model from Xilinx is a powerful and versatile FPGA (Field Programmable Gate Array) device. It is designed to provide a variety of I/O (Input/Output) and system-level designs for a wide range of applications, including high-speed communication systems, industrial automation, and embedded systems.


This chip model is equipped with a high-speed, low-power Spartan-3E FPGA device, which is capable of delivering up to 300K logic cells and up to 256MB of DDR2 SDRAM. It also features a Xilinx Platform Flash memory, which is used to store the configuration data of the FPGA devices. It is designed to provide a high-speed, low-power solution for a variety of applications.


The XC2S300E-7FG256I chip model has several advantages over other FPGA devices. It is designed to provide a high-speed, low-power solution for a wide range of applications. It is also highly reliable and cost-effective, making it an ideal choice for a variety of applications. Additionally, it is designed to be compatible with the latest technologies, such as PCI Express, Gigabit Ethernet, USB 2.0, and more.


The XC2S300E-7FG256I chip model is expected to be in high demand in the future due to its versatile design and its ability to be used in a wide range of applications. It is expected to be used in industrial automation, high-speed communication systems, and embedded systems. Additionally, it is expected to be used in advanced communication systems, such as Wi-Fi, Bluetooth, and more.


The XC2S300E-7FG256I chip model is designed to meet specific design requirements. It has a wide range of I/O ports, which can be used to connect to various peripherals. Additionally, it is designed to be compatible with the latest technologies, such as PCI Express, Gigabit Ethernet, USB 2.0, and more. It is also designed to be highly reliable and cost-effective.


The XC2S300E-7FG256I chip model has been successfully used in a variety of applications. For example, it has been used in industrial automation, high-speed communication systems, and embedded systems. Additionally, it has been used in advanced communication systems, such as Wi-Fi, Bluetooth, and more.


When using the XC2S300E-7FG256I chip model, there are certain precautions that should be taken. For example, it is important to ensure that the chip is properly configured and that the correct settings are used. Additionally, it is important to ensure that the chip is properly cooled and that any necessary upgrades are completed in a timely manner.


In conclusion, the XC2S300E-7FG256I chip model from Xilinx is a powerful and versatile FPGA device. It is designed to provide a high-speed, low-power solution for a wide range of applications, including industrial automation, high-speed communication systems, and embedded systems. Additionally, it is expected to be in high demand in the future due to its versatile design and its ability to be used in a variety of applications. When using the XC2S300E-7FG256I chip model, it is important to ensure that the chip is properly configured and that the correct settings are used, as well as that the chip is properly cooled and that any necessary upgrades are completed in a timely manner.



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