AMD Xilinx
XC2S300E-6FGG456I
XC2S300E-6FGG456I ECAD Model
XC2S300E-6FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S300E-6FGG456I Datasheet Download
XC2S300E-6FGG456I Overview
The XC2S300E-6FGG456I chip model is a revolutionary piece of technology that has been designed to provide the highest levels of performance and reliability. It is a highly integrated device that is capable of providing the necessary computing power for a variety of applications. The chip model offers users a wide range of features and capabilities, including high-speed data processing, high-speed memory access, and low-power consumption.
The XC2S300E-6FGG456I chip model is designed for a wide range of applications, including industrial, automotive, medical, and communication systems. This chip model offers users high-speed data processing, low-power consumption, and a wide range of features and capabilities. The chip model is also designed with the latest technologies and protocols, such as Ethernet, USB, and Bluetooth, to allow users to easily connect to the internet and other devices.
The XC2S300E-6FGG456I chip model has been designed to provide the highest levels of performance and reliability. The chip model features a powerful processor and memory, as well as a wide range of features and capabilities. The chip model is designed to deliver high-speed data processing, low-power consumption, and a wide range of features and capabilities. The chip model is also designed with advanced technologies and protocols, such as Ethernet, USB, and Bluetooth, to allow users to easily connect to the internet and other devices.
The XC2S300E-6FGG456I chip model is expected to be in high demand in the future due to its advanced features and capabilities. The chip model is designed to provide users with a wide range of features and capabilities, including high-speed data processing, low-power consumption, and a wide range of features and capabilities. The chip model is also designed with advanced technologies and protocols, such as Ethernet, USB, and Bluetooth, to allow users to easily connect to the internet and other devices.
The XC2S300E-6FGG456I chip model is designed with the original intention of providing users with the highest levels of performance and reliability. The chip model is designed with the latest technologies and protocols, such as Ethernet, USB, and Bluetooth, to allow users to easily connect to the internet and other devices. The chip model is also designed to be upgradable and can be applied to advanced communication systems.
The product description and specific design requirements of the XC2S300E-6FGG456I chip model are available in the product documentation. The product description and specific design requirements include the chip model’s processor, memory, and other features and capabilities. The product description also includes information about the chip model’s power consumption, operating temperature, and other design requirements.
The XC2S300E-6FGG456I chip model has been used in a variety of applications, including industrial, automotive, medical, and communication systems. The chip model has proven to be reliable and efficient in these applications. The chip model has also been used in a variety of case studies and has been proven to be reliable and efficient in these applications.
When using the XC2S300E-6FGG456I chip model, it is important to follow the product documentation and design requirements. It is also important to ensure that the chip model is properly installed and configured. It is also important to ensure that the chip model is not exposed to extreme temperatures or environmental conditions that could cause damage or reduce the chip model’s performance.
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