AMD Xilinx
XC2S300E-6FGG456C
XC2S300E-6FGG456C ECAD Model
XC2S300E-6FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S300E-6FGG456C Datasheet Download
XC2S300E-6FGG456C Overview
The chip model XC2S300E-6FGG456C is a powerful and versatile chip that is widely used in a variety of industries. It is a high-performance, low-power, and low-cost application-specific integrated circuit (ASIC) designed for embedded systems. This chip is capable of performing a variety of tasks, such as data processing, communication, and control.
In terms of industry trends, the XC2S300E-6FGG456C chip model is a cutting-edge technology that is being increasingly adopted by different industries. This chip model is being used in a variety of applications, ranging from consumer electronics to industrial automation and robotics. Furthermore, this chip model is also being used in the development of advanced artificial intelligence (AI) applications.
In terms of future development, the XC2S300E-6FGG456C chip model is expected to become even more powerful and versatile in the future. This chip model is expected to be used in more applications, such as autonomous vehicles and smart homes. Furthermore, this chip model is expected to be used in the development of more advanced AI applications, such as natural language processing and image recognition.
In terms of application environment, the XC2S300E-6FGG456C chip model is capable of supporting a wide range of new technologies. This chip model is capable of supporting a variety of protocols, such as Ethernet, Wi-Fi, Bluetooth, and Zigbee. Furthermore, this chip model is also capable of supporting a variety of operating systems, such as Linux, Windows, and Android.
In terms of product description and specific design requirements, the XC2S300E-6FGG456C chip model is designed with a low-power, high-performance architecture. This chip model is designed to be highly reliable and efficient, and it is capable of supporting a variety of applications. Furthermore, this chip model is also designed to be easily integrated into existing systems.
In terms of actual case studies and precautions, the XC2S300E-6FGG456C chip model has been used in a variety of projects, ranging from consumer electronics to industrial automation and robotics. Furthermore, this chip model has been used in the development of advanced AI applications, such as natural language processing and image recognition.
Finally, in terms of whether the XC2S300E-6FGG456C chip model can be applied to the development and popularization of future intelligent robots, it is possible. This chip model is capable of supporting a variety of technologies and protocols, and it is capable of supporting a variety of operating systems. Furthermore, this chip model is also capable of supporting a variety of applications. However, in order to effectively use this chip model, technical talents with the necessary knowledge and skills are required.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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