AMD Xilinx
XC2S300E-6FG456Q
XC2S300E-6FG456Q ECAD Model
XC2S300E-6FG456Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM NO OF GATE 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S300E-6FG456Q Datasheet Download
XC2S300E-6FG456Q Overview
The chip model XC2S300E-6FG456Q is a highly advanced chip model that offers a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to provide a powerful and reliable solution for a variety of applications.
The original design intention of the XC2S300E-6FG456Q chip model was to provide a powerful and reliable solution for a wide range of applications. This chip model can be easily upgraded and integrated with other components to meet the changing needs of the customer. It can be used in various types of communication systems, such as wireless networks, mobile networks, and optical networks. It is also capable of being used in the era of fully intelligent systems.
The chip model XC2S300E-6FG456Q is also suitable for various intelligent scenarios. It can be used in intelligent home and office automation, intelligent transportation, and intelligent surveillance systems. It is also capable of being used in advanced communication systems, such as 5G networks and the Internet of Things (IoT). Furthermore, it can be used in artificial intelligence (AI) applications, such as machine learning and natural language processing.
In conclusion, the chip model XC2S300E-6FG456Q is a powerful and reliable solution for a variety of applications. It is designed to provide a high level of performance and reliability, and can be easily upgraded and integrated with other components. It is suitable for various intelligent scenarios and can be used in advanced communication systems, such as 5G networks and the Internet of Things (IoT). It is also capable of being used in the era of fully intelligent systems, such as artificial intelligence (AI).
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3,644 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $34.5960 | $34.5960 |
| 10+ | $34.2240 | $342.2400 |
| 100+ | $32.3640 | $3,236.4000 |
| 1000+ | $30.5040 | $15,252.0000 |
| 10000+ | $27.9000 | $27,900.0000 |
| The price is for reference only, please refer to the actual quotation! | ||