AMD Xilinx
XC2S30-5PQG208C
XC2S30-5PQG208C ECAD Model
XC2S30-5PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 136 | |
| Number of Outputs | 132 | |
| Number of Logic Cells | 972 | |
| Number of Equivalent Gates | 30000 | |
| Number of CLBs | 216 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Organization | 216 CLBS, 30000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP208,1.2SQ,20 | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2S30-5PQG208C Datasheet Download
XC2S30-5PQG208C Overview
The XC2S30-5PQG208C chip model is a powerful digital signal processor (DSP) that is well-suited for high-performance digital signal processing, embedded processing, and image processing. It requires the use of the HDL (Hardware Description Language) language to program and operate. This chip model is a testament to the ever-evolving nature of technology, and its potential applications are vast.
The XC2S30-5PQG208C chip model has the potential to be used in a variety of industries and applications. It can be used for a variety of tasks, such as machine learning, artificial intelligence, and autonomous vehicles. It can also be used for applications such as robotics, smart home automation, and more. Additionally, it can be used for network applications, such as video streaming, data transfer, and more.
In terms of the future development of the XC2S30-5PQG208C chip model, it is likely that new technologies will be needed to support the application environment. These technologies could include 5G networks, AI-enabled systems, and more. Additionally, the chip model could be used in the era of fully intelligent systems, such as the Internet of Things (IoT). This could include applications such as smart homes, smart cities, and more.
Overall, the XC2S30-5PQG208C chip model is a powerful and versatile processor that has the potential to be used in a variety of applications. With the ever-evolving nature of technology, it is likely that new technologies will be needed to support the application environment. Furthermore, the chip model could be used in the era of fully intelligent systems, such as the Internet of Things (IoT). As such, the possibilities for the XC2S30-5PQG208C chip model are seemingly endless.
You May Also Be Interested In
2,608 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.1577 | $13.1577 |
| 10+ | $13.0163 | $130.1625 |
| 100+ | $12.3088 | $1,230.8847 |
| 1000+ | $11.6014 | $5,800.7210 |
| 10000+ | $10.6111 | $10,611.0750 |
| The price is for reference only, please refer to the actual quotation! | ||