AMD Xilinx
XC2S200E-7FGG456C
XC2S200E-7FGG456C ECAD Model
XC2S200E-7FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S200E-7FGG456C Datasheet Download
XC2S200E-7FGG456C Overview
The chip model XC2S200E-7FGG456C is a cutting-edge technology developed by Xilinx, Inc. It is designed to meet the high-performance needs of the most demanding applications. This model is equipped with advanced features such as a high-speed clock, low power consumption, and a wide range of I/O options. It is suitable for a variety of applications, including telecommunications, medical, and industrial automation.
The chip model XC2S200E-7FGG456C is a high-performance model that is capable of meeting the needs of the most demanding applications. It has a high-speed clock, low power consumption, and a wide range of I/O options. It is suitable for a variety of applications, including telecommunications, medical, and industrial automation.
The chip model XC2S200E-7FGG456C is designed to meet the needs of the most demanding applications. It has a high-speed clock, low power consumption, and a wide range of I/O options. It is suitable for a variety of applications, including telecommunications, medical, and industrial automation.
In terms of industry trends, the chip model XC2S200E-7FGG456C is expected to remain relevant in the future. It is capable of supporting new technologies, such as 5G, Wi-Fi 6, and AI, which are becoming increasingly important in the modern world. The chip model is also expected to be used in the development and popularization of future intelligent robots.
As for the future development of related industries, the chip model XC2S200E-7FGG456C can be used to improve the performance of existing applications. It can also be used to develop new applications, such as autonomous driving and robotics, which require advanced technologies. In addition, the chip model can be used to develop new technologies for communication systems.
In order to use the chip model XC2S200E-7FGG456C effectively, technical talents with knowledge of the chip model and related technologies are needed. They should have an understanding of the chip model’s original design intention and the possibility of future upgrades. They should also be familiar with the technologies that are required to support the application environment.
In conclusion, the chip model XC2S200E-7FGG456C is a high-performance model that is capable of meeting the needs of the most demanding applications. It is expected to remain relevant in the future and can be used to support new technologies, develop intelligent robots, and improve the performance of existing applications. Technical talents with knowledge of the chip model and related technologies are needed in order to use the chip model effectively.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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