XC2S200E-7FG456C
XC2S200E-7FG456C
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rohs

AMD Xilinx

XC2S200E-7FG456C


XC2S200E-7FG456C
F20-XC2S200E-7FG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-456
FBGA-456

XC2S200E-7FG456C ECAD Model


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XC2S200E-7FG456C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 5292
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL EXTENDED
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D
Part Package Code BGA
Package Description FBGA-456
Pin Count 456

XC2S200E-7FG456C Datasheet Download


XC2S200E-7FG456C Overview



The XC2S200E-7FG456C chip model is a high-performance, low-power field-programmable gate array (FPGA) designed for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. This chip model is suitable for applications that require the use of HDL (Hardware Description Language) for implementation.


The product description of the XC2S200E-7FG456C chip model includes its features, such as its high-performance and low-power design, its large capacity for data storage, and its wide range of I/O pins. This chip model is also equipped with a variety of logic blocks, such as RAM blocks, multipliers, and DSP blocks. In addition, this chip model also supports the use of a variety of programming languages, such as Verilog and VHDL.


When designing a system with the XC2S200E-7FG456C chip model, it is important to consider the specific design requirements. For example, it is important to consider the power requirements, the clock frequency, the number of I/O pins, the size of the data storage, the programming language, and the types of logic blocks needed. In addition, it is also important to consider the timing constraints and the cost of the system.


The XC2S200E-7FG456C chip model can be used in the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and data storage capacity for the development of robots. In addition, this chip model can also be used to implement various algorithms, such as machine learning, neural networks, and object recognition. To use this chip model effectively, it is important to have a good understanding of HDL programming, as well as a good understanding of the specific design requirements of the chip model.


In conclusion, the XC2S200E-7FG456C chip model is a powerful and low-power FPGA that can be used for a variety of applications, such as digital signal processing, embedded processing, and image processing. This chip model can also be used in the development and popularization of future intelligent robots. To use this chip model effectively, it is important to have a good understanding of HDL programming, as well as a good understanding of the specific design requirements of the chip model.



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