
AMD Xilinx
XC2S200E-7FG456C
XC2S200E-7FG456C ECAD Model
XC2S200E-7FG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL EXTENDED | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D | |
Part Package Code | BGA | |
Package Description | FBGA-456 | |
Pin Count | 456 |
XC2S200E-7FG456C Datasheet Download
XC2S200E-7FG456C Overview
The XC2S200E-7FG456C chip model is a high-performance, low-power field-programmable gate array (FPGA) designed for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. This chip model is suitable for applications that require the use of HDL (Hardware Description Language) for implementation.
The product description of the XC2S200E-7FG456C chip model includes its features, such as its high-performance and low-power design, its large capacity for data storage, and its wide range of I/O pins. This chip model is also equipped with a variety of logic blocks, such as RAM blocks, multipliers, and DSP blocks. In addition, this chip model also supports the use of a variety of programming languages, such as Verilog and VHDL.
When designing a system with the XC2S200E-7FG456C chip model, it is important to consider the specific design requirements. For example, it is important to consider the power requirements, the clock frequency, the number of I/O pins, the size of the data storage, the programming language, and the types of logic blocks needed. In addition, it is also important to consider the timing constraints and the cost of the system.
The XC2S200E-7FG456C chip model can be used in the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and data storage capacity for the development of robots. In addition, this chip model can also be used to implement various algorithms, such as machine learning, neural networks, and object recognition. To use this chip model effectively, it is important to have a good understanding of HDL programming, as well as a good understanding of the specific design requirements of the chip model.
In conclusion, the XC2S200E-7FG456C chip model is a powerful and low-power FPGA that can be used for a variety of applications, such as digital signal processing, embedded processing, and image processing. This chip model can also be used in the development and popularization of future intelligent robots. To use this chip model effectively, it is important to have a good understanding of HDL programming, as well as a good understanding of the specific design requirements of the chip model.
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