AMD Xilinx
XC2S200E-6PQG208I
XC2S200E-6PQG208I ECAD Model
XC2S200E-6PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 289 | |
| Number of Outputs | 289 | |
| Number of Logic Cells | 5292 | |
| Number of Equivalent Gates | 71000 | |
| Number of CLBs | 1176 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1176 CLBS, 71000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 200000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S200E-6PQG208I Datasheet Download
XC2S200E-6PQG208I Overview
The XC2S200E-6PQG208I chip model is a revolutionary piece of technology that has been designed to provide users with a range of advantages and features. This chip model is one of the latest additions to the Xilinx FPGA family and it offers a wide range of features that can be used to benefit users in a variety of industries.
The XC2S200E-6PQG208I chip model was designed with the intention of providing users with a high-performance, low-power, and highly reliable solution. The chip model is equipped with a number of features that make it suitable for use in a variety of applications, including advanced communications systems. It is capable of providing users with a range of advantages, such as reduced power consumption, improved performance, and increased reliability.
The XC2S200E-6PQG208I chip model is an ideal solution for users who are looking for a cost-effective and reliable solution for their applications. The chip model has been designed to provide users with a range of features, such as an integrated memory controller, high-speed I/O, and a wide range of configurable options. The chip model also offers users the ability to upgrade their systems with additional features, such as additional memory and I/O capabilities, as well as support for advanced communication protocols.
The XC2S200E-6PQG208I chip model is a highly versatile solution that can be used in a variety of industries. It is suitable for use in a range of applications, such as automotive, industrial, and consumer electronics. In addition, it can be used in a wide range of advanced communication systems, such as cellular networks, satellite communications, and wireless networks.
When designing the XC2S200E-6PQG208I chip model, Xilinx has taken into consideration the specific design requirements of the chip. The chip model has been designed to provide users with a range of features, such as an integrated memory controller, high-speed I/O, and a wide range of configurable options. In addition, the chip model also offers users the ability to upgrade their systems with additional features, such as additional memory and I/O capabilities, as well as support for advanced communication protocols.
The XC2S200E-6PQG208I chip model is a highly reliable and cost-effective solution for users who are looking for a solution for their applications. The chip model is capable of providing users with a range of advantages, such as reduced power consumption, improved performance, and increased reliability. In addition, the chip model can be used in a variety of industries and applications, such as automotive, industrial, and consumer electronics.
In terms of future demand trends, the XC2S200E-6PQG208I chip model is expected to be in high demand in a variety of industries. As the chip model is capable of providing users with a range of features, such as an integrated memory controller, high-speed I/O, and a wide range of configurable options, it is expected to be in high demand in a variety of industries, such as automotive, industrial, and consumer electronics. In addition, the chip model is also expected to be in high demand in advanced communication systems, such as cellular networks, satellite communications, and wireless networks.
When using the XC2S200E-6PQG208I chip model, it is important to ensure that the chip model is properly installed and configured. In addition, it is important to ensure that the chip model is properly maintained and that all of the components are properly connected. In addition, it is important to ensure that the chip model is properly tested and that all of the components are properly connected. Finally, it is important to ensure that the chip model is properly protected from environmental conditions, such as dust and moisture.
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|---|---|---|
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