XC2S200E-6FGG456I
XC2S200E-6FGG456I
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rohs

AMD Xilinx

XC2S200E-6FGG456I


XC2S200E-6FGG456I
F20-XC2S200E-6FGG456I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-456
LEAD FREE, FBGA-456

XC2S200E-6FGG456I ECAD Model


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XC2S200E-6FGG456I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 5292
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-456
Pin Count 456
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XC2S200E-6FGG456I Datasheet Download


XC2S200E-6FGG456I Overview



The XC2S200E-6FGG456I chip model is a highly advanced integrated circuit designed for high performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which is an industry standard for programming hardware devices. The chip model is built with a focus on providing a reliable and efficient solution for data processing tasks.


The XC2S200E-6FGG456I chip model was designed with the intention of providing a reliable and efficient solution for data processing tasks. It is equipped with a wide range of features and capabilities that make it suitable for a variety of applications. The chip model is also designed with the possibility of future upgrades in mind, making it suitable for use in advanced communication systems.


The product description of the XC2S200E-6FGG456I chip model includes details on its design and features. It is equipped with a wide range of features, such as a high-performance digital signal processor, embedded processor, and image processor. The chip model is also designed to be used with HDL language, which is an industry standard for programming hardware devices.


In addition, there are several case studies and practical considerations when using the XC2S200E-6FGG456I chip model. For example, the chip model has been tested in various applications, such as image processing, embedded processing, and digital signal processing. It is also important to note that the chip model requires proper power management and cooling to ensure that it performs optimally.


In conclusion, the XC2S200E-6FGG456I chip model is a highly advanced integrated circuit designed for high performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language and is equipped with a wide range of features and capabilities that make it suitable for a variety of applications. Furthermore, the chip model is designed with the possibility of future upgrades in mind, making it suitable for use in advanced communication systems. Additionally, there are several case studies and practical considerations when using the XC2S200E-6FGG456I chip model, such as proper power management and cooling, which are essential for optimal performance.



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