
AMD Xilinx
XC2S200E-6FGG456I
XC2S200E-6FGG456I ECAD Model
XC2S200E-6FGG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC2S200E-6FGG456I Datasheet Download
XC2S200E-6FGG456I Overview
The XC2S200E-6FGG456I chip model is a highly advanced integrated circuit designed for high performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which is an industry standard for programming hardware devices. The chip model is built with a focus on providing a reliable and efficient solution for data processing tasks.
The XC2S200E-6FGG456I chip model was designed with the intention of providing a reliable and efficient solution for data processing tasks. It is equipped with a wide range of features and capabilities that make it suitable for a variety of applications. The chip model is also designed with the possibility of future upgrades in mind, making it suitable for use in advanced communication systems.
The product description of the XC2S200E-6FGG456I chip model includes details on its design and features. It is equipped with a wide range of features, such as a high-performance digital signal processor, embedded processor, and image processor. The chip model is also designed to be used with HDL language, which is an industry standard for programming hardware devices.
In addition, there are several case studies and practical considerations when using the XC2S200E-6FGG456I chip model. For example, the chip model has been tested in various applications, such as image processing, embedded processing, and digital signal processing. It is also important to note that the chip model requires proper power management and cooling to ensure that it performs optimally.
In conclusion, the XC2S200E-6FGG456I chip model is a highly advanced integrated circuit designed for high performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language and is equipped with a wide range of features and capabilities that make it suitable for a variety of applications. Furthermore, the chip model is designed with the possibility of future upgrades in mind, making it suitable for use in advanced communication systems. Additionally, there are several case studies and practical considerations when using the XC2S200E-6FGG456I chip model, such as proper power management and cooling, which are essential for optimal performance.
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