
AMD Xilinx
XC2S200E-6FG456I
XC2S200E-6FG456I ECAD Model
XC2S200E-6FG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2S200E-6FG456I Datasheet Download
XC2S200E-6FG456I Overview
The XC2S200E-6FG456I chip model is a powerful and versatile model from the Xilinx Spartan series of field-programmable gate arrays (FPGA). It is designed for high-performance digital signal processing, embedded processing, and image processing applications. It is capable of handling complex tasks with ease and is ideal for a wide range of industries.
The XC2S200E-6FG456I chip model has many advantages. It is highly programmable, allowing engineers to customize the chip to meet their specific needs. It is also energy efficient, reducing power consumption while still providing high performance. Additionally, the chip is highly reliable and can be used in a variety of applications.
The demand for the XC2S200E-6FG456I chip model is expected to increase in the future as more industries, such as robotics, develop and adopt the technology. The chip model is well-suited for complex tasks, making it an ideal choice for the development and popularization of future intelligent robots. It is also capable of handling the ever-increasing data processing needs of the robotics industry.
To use the XC2S200E-6FG456I chip model effectively, engineers must be proficient in the HDL (Hardware Description Language). This language is used to program the chip, allowing engineers to customize it for their specific needs. Engineers must also be familiar with the chip's architecture and be able to troubleshoot any issues that may arise.
In conclusion, the XC2S200E-6FG456I chip model is a powerful and versatile model from the Xilinx Spartan series of field-programmable gate arrays (FPGA). It is well-suited for high-performance digital signal processing, embedded processing, and image processing applications and is expected to be in high demand in the future. Additionally, it is capable of handling the complex tasks needed for the development and popularization of future intelligent robots. To use the model effectively, engineers must be proficient in the HDL language and have a strong understanding of the chip's architecture.
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4,673 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $64.2816 | $64.2816 |
10+ | $63.5904 | $635.9040 |
100+ | $60.1344 | $6,013.4400 |
1000+ | $56.6784 | $28,339.2000 |
10000+ | $51.8400 | $51,840.0000 |
The price is for reference only, please refer to the actual quotation! |