XC2S200E-6FG256C
XC2S200E-6FG256C
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AMD Xilinx

XC2S200E-6FG256C


XC2S200E-6FG256C
F20-XC2S200E-6FG256C
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XC2S200E-6FG256C ECAD Model


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XC2S200E-6FG256C Attributes


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XC2S200E-6FG256C Overview



The Xilinx XC2S200E-6FG256C chip model is a high-performance, low-power FPGA (Field Programmable Gate Array) device. It is designed to provide a high level of flexibility and scalability for a variety of applications. The XC2S200E-6FG256C has a 6-layer metal programmable logic fabric, 256 Kbits of on-chip RAM, and an array of I/O resources. It can be used for a wide range of applications, including advanced communication systems, networks, and intelligent scenarios.


The original design intention of the XC2S200E-6FG256C was to provide a cost-effective solution for customers who need a reliable and efficient FPGA. It is designed to be highly configurable and can be easily upgraded to meet the changing needs of customers. It is also designed to be power-efficient and can be used in a variety of applications with minimal power consumption.


The XC2S200E-6FG256C is a great choice for advanced communication systems and networks. It has the capability to support high-speed data transfer and can be used for a variety of applications, including 5G networks, wireless communications, and data center applications. It is also suitable for intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing.


The product description of the XC2S200E-6FG256C includes detailed specifications on the device, including the number of logic elements, the number of RAM blocks, and the number of I/O pins. It also includes the power consumption, the operating temperature range, and the device package type. The XC2S200E-6FG256C is designed to be highly configurable and can be easily upgraded to meet the changing needs of customers.


In addition to the product description, there are also several case studies and precautions that should be taken when using the XC2S200E-6FG256C. For example, it is important to ensure that the device is properly configured and that the power consumption is within the specified limits. It is also important to ensure that the device is used in an environment that is suitable for the device, such as a temperature-controlled environment.


In conclusion, the Xilinx XC2S200E-6FG256C chip model is a great choice for advanced communication systems and networks. It is designed to provide a high level of flexibility and scalability, and can be easily upgraded to meet the changing needs of customers. It is also suitable for intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. With its detailed product description, case studies, and precautions, the XC2S200E-6FG256C is a reliable and cost-effective solution for customers who need a reliable and efficient FPGA.



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