AMD Xilinx
XC2S150E-7PQG208C
XC2S150E-7PQG208C ECAD Model
XC2S150E-7PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 265 | |
| Number of Outputs | 265 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S150E-7PQG208C Datasheet Download
XC2S150E-7PQG208C Overview
The XC2S150E-7PQG208C chip model is a powerful and versatile tool for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. The model is equipped with a number of features that make it an ideal choice for developers.
The XC2S150E-7PQG208C chip model has the advantage of being able to process data quickly and accurately. It is also capable of running multiple tasks simultaneously, which makes it an ideal choice for applications that require high performance. Furthermore, the chip has a low power consumption, which makes it an ideal choice for applications that require low power consumption. In addition, the model is also equipped with a number of features that make it easy to use, such as its high-speed parallel processing, its ability to support multiple languages, and its high-speed memory.
The demand for the XC2S150E-7PQG208C chip model is expected to increase in the future. This is due to the fact that the model is capable of handling a wide range of tasks and applications, and is also capable of running multiple tasks simultaneously. Furthermore, the chip model is also ideal for applications that require low power consumption, which makes it an ideal choice for applications that require low power consumption.
The XC2S150E-7PQG208C chip model can be applied to the development and popularization of future intelligent robots. This is due to its ability to process data quickly and accurately, its ability to support multiple languages, and its ability to run multiple tasks simultaneously. In order to use the model effectively, developers need to be familiar with the HDL language, as well as have a good understanding of the chip model and its capabilities. Additionally, developers need to have a good understanding of the different types of robots and their capabilities in order to be able to develop and popularize them effectively.
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|---|---|---|
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