AMD Xilinx
XC2S150E-7PQ208C
XC2S150E-7PQ208C ECAD Model
XC2S150E-7PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 263 | |
| Number of Outputs | 263 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S150E-7PQ208C Datasheet Download
XC2S150E-7PQ208C Overview
The XC2S150E-7PQ208C chip model is an innovative product developed by Xilinx, a leader in the field of programmable logic devices. It is designed to provide users with high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with the latest advanced technology and requires the use of HDL language for programming.
The XC2S150E-7PQ208C chip model is designed to meet the needs of customers for high-performance and low-cost applications. It is the perfect choice for those who are looking for a reliable, cost-effective solution for their projects. The chip model is designed to be flexible and can be upgraded and customized to meet the customer's specific requirements.
The chip model is also suitable for advanced communication systems. It is designed with a high-speed and low-power architecture that can provide the best performance for communication systems. It also has a low-cost and low-power design that can help reduce the cost of the system.
The product description of XC2S150E-7PQ208C chip model includes features such as high-performance digital signal processing, embedded processing, image processing, and other applications. It is also designed with a high-speed and low-power architecture that can provide the best performance for communication systems. The chip model also has a low-cost and low-power design that can help reduce the cost of the system.
In addition, the chip model also has a variety of design options and features to meet the customer's specific requirements. It is also designed with advanced features such as on-chip memory, clock management, and other features that can help improve performance.
When designing projects with the XC2S150E-7PQ208C chip model, it is important to consider the design requirements and actual case studies. It is also important to take into account the power requirements and other factors that can affect the performance of the chip model. Additionally, it is also important to consider the safety and reliability of the chip model in order to ensure the best performance.
In conclusion, the XC2S150E-7PQ208C chip model is an innovative product developed by Xilinx. It is designed to provide users with high-performance digital signal processing, embedded processing, image processing, and other applications. It is built with the latest advanced technology and requires the use of HDL language for programming. The chip model is also suitable for advanced communication systems and is designed with a high-speed and low-power architecture that can provide the best performance for communication systems. It also has a low-cost and low-power design that can help reduce the cost of the system. When designing projects with the XC2S150E-7PQ208C chip model, it is important to consider the design requirements and actual case studies, as well as the power requirements and other factors that can affect the performance of the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||