AMD Xilinx
XC2S150E-6PQG208I
XC2S150E-6PQG208I ECAD Model
XC2S150E-6PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 265 | |
| Number of Outputs | 265 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S150E-6PQG208I Datasheet Download
XC2S150E-6PQG208I Overview
XC2S150E-6PQG208I is a chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful, versatile, and reliable solution for meeting the needs of these industries. The chip model is based on the Xilinx Virtex-II Pro FPGA platform and is designed to be programmed using the HDL language. It is capable of performing complex calculations and operations quickly and efficiently.
The XC2S150E-6PQG208I chip model offers a number of advantages over other models, such as its high speed, low power consumption, and flexibility. It also has a number of features that make it suitable for use in a wide range of applications, including its ability to be used in high-performance digital signal processing, embedded processing, image processing, and other demanding tasks. Furthermore, the chip model is expected to be in high demand in the future as the need for high-performance solutions continues to grow.
The XC2S150E-6PQG208I chip model can be used in a variety of network applications, such as network security, data transmission, and network management. It can also be used in a number of intelligent scenarios, such as machine learning, natural language processing, and artificial intelligence. The chip model is also capable of being used in the era of fully intelligent systems, where it can be used to power self-driving cars, smart homes, and other intelligent systems.
In conclusion, the XC2S150E-6PQG208I chip model is a powerful, versatile, and reliable solution for meeting the needs of high-performance digital signal processing, embedded processing, image processing, and other demanding tasks. It offers a number of advantages over other models, and it is expected to be in high demand in the future. It can also be used in a variety of network applications and intelligent scenarios, and it is capable of being used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||