AMD Xilinx
XC2S150E-6PQ208C
XC2S150E-6PQ208C ECAD Model
XC2S150E-6PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 263 | |
| Number of Outputs | 263 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Package Description | PLASTIC, QFP-208 | |
| ECCN Code | EAR99 | |
| Part Package Code | QFP | |
| Pin Count | 208 |
XC2S150E-6PQ208C Datasheet Download
XC2S150E-6PQ208C Overview
The Xilinx XC2S150E-6PQ208C chip model is a low-cost, low-power FPGA device with a range of features that make it suitable for a variety of applications. It is a mid-range FPGA device, with a maximum capacity of 150,000 logic cells and a maximum of 6,000 Kbits of RAM. It also has a range of I/O options, which makes it suitable for a variety of applications.
The XC2S150E-6PQ208C chip model is ideal for use in embedded systems and networks, as it is highly reliable and low-power, and can be used in a wide range of applications. It is capable of handling complex tasks such as data processing, image processing, and signal processing. It is also suitable for use in industrial automation and control systems, as it can be used to control a variety of components and devices.
The XC2S150E-6PQ208C chip model is expected to be in high demand in the future, as it is well-suited for use in the development of intelligent systems. It can be used in a wide range of applications, including machine learning, natural language processing, and computer vision. It is also suitable for use in the development of autonomous robots, as it can be used to control a variety of components and devices.
The XC2S150E-6PQ208C chip model is also suitable for use in the development of fully intelligent systems. It is capable of handling complex tasks such as data processing, image processing, and signal processing. It is also suitable for use in the development of autonomous robots, as it can be used to control a variety of components and devices.
In order to effectively use the XC2S150E-6PQ208C chip model, technical talents such as software engineers, hardware engineers, and computer scientists are required. Software engineers are needed to design and develop the software for the chip model, while hardware engineers are needed to design and develop the hardware for the chip model. Computer scientists are needed to design and develop algorithms for the chip model, as well as to develop the software and hardware for the chip model.
In conclusion, the Xilinx XC2S150E-6PQ208C chip model is an ideal choice for use in the development of intelligent systems and autonomous robots. It is highly reliable and low-power, and can be used in a wide range of applications. It is expected to be in high demand in the future, and technical talents such as software engineers, hardware engineers, and computer scientists are required to effectively use the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||