XC2S150E-6FGG456I
XC2S150E-6FGG456I
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rohs

AMD Xilinx

XC2S150E-6FGG456I


XC2S150E-6FGG456I
F20-XC2S150E-6FGG456I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-456
LEAD FREE, FBGA-456

XC2S150E-6FGG456I ECAD Model


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XC2S150E-6FGG456I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 265
Number of Outputs 265
Number of Logic Cells 3888
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-456
Pin Count 456
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2S150E-6FGG456I Datasheet Download


XC2S150E-6FGG456I Overview



The XC2S150E-6FGG456I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed with a high-performance architecture and requires the use of HDL language for programming. The chip model is suitable for a wide range of applications, from automotive to industrial automation, and has become increasingly popular in these industries due to its high performance and low power consumption.


The chip model is based on the latest Xilinx FPGA technology, which enables it to process data faster and more efficiently than traditional processors. The chip model is designed to be highly scalable, allowing users to customize the design to their specific needs. It also supports a wide range of I/O interfaces, including Ethernet, USB, and serial ports, making it easy to integrate with existing systems.


The chip model is capable of handling complex tasks, such as real-time image processing, video streaming, and data analysis. It is also capable of performing multiple operations simultaneously, making it ideal for applications requiring high throughput. The chip model also provides support for advanced features such as error correction, encryption, and secure boot.


The chip model is designed to be compatible with a wide range of development environments, including VHDL, Verilog, and SystemVerilog. The chip model is also designed to be compatible with other Xilinx products, such as the Zynq UltraScale+ MPSoC and the Kintex UltraScale+ FPGAs.


The chip model is designed to be used in a variety of industries, including automotive, aerospace, industrial automation, medical, and consumer electronics. The chip model is also designed to be used in a variety of applications, including image processing, automotive safety, and industrial automation.


To ensure the best results, it is important to understand the specific requirements of the application and the design of the chip model. This includes understanding the data flow, the timing requirements, and the power requirements. It is also important to understand the specific design requirements of the chip model, such as the clock frequency, the number of logic elements, and the number of I/O pins.


In order to ensure that the chip model is used in the most efficient manner, it is important to evaluate the design for any potential problems or issues. It is also important to consider the design of the chip model in terms of the future development of related industries and technologies. This includes determining if the application environment requires the support of new technologies or if the existing technologies can be used.


The chip model is designed to provide a high-performance solution for a wide range of applications. By understanding the specific requirements of the application and the design of the chip model, users can ensure that they get the most out of the chip model. With the right design and implementation, the chip model can provide a powerful and reliable solution for any application.



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Unit Price: $99.20
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Pricing (USD)

QTY Unit Price Ext Price
1+ $92.2560 $92.2560
10+ $91.2640 $912.6400
100+ $86.3040 $8,630.4000
1000+ $81.3440 $40,672.0000
10000+ $74.4000 $74,400.0000
The price is for reference only, please refer to the actual quotation!

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