
AMD Xilinx
XC2S150E-6FGG456I
XC2S150E-6FGG456I ECAD Model
XC2S150E-6FGG456I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 265 | |
Number of Outputs | 265 | |
Number of Logic Cells | 3888 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2S150E-6FGG456I Datasheet Download
XC2S150E-6FGG456I Overview
The XC2S150E-6FGG456I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed with a high-performance architecture and requires the use of HDL language for programming. The chip model is suitable for a wide range of applications, from automotive to industrial automation, and has become increasingly popular in these industries due to its high performance and low power consumption.
The chip model is based on the latest Xilinx FPGA technology, which enables it to process data faster and more efficiently than traditional processors. The chip model is designed to be highly scalable, allowing users to customize the design to their specific needs. It also supports a wide range of I/O interfaces, including Ethernet, USB, and serial ports, making it easy to integrate with existing systems.
The chip model is capable of handling complex tasks, such as real-time image processing, video streaming, and data analysis. It is also capable of performing multiple operations simultaneously, making it ideal for applications requiring high throughput. The chip model also provides support for advanced features such as error correction, encryption, and secure boot.
The chip model is designed to be compatible with a wide range of development environments, including VHDL, Verilog, and SystemVerilog. The chip model is also designed to be compatible with other Xilinx products, such as the Zynq UltraScale+ MPSoC and the Kintex UltraScale+ FPGAs.
The chip model is designed to be used in a variety of industries, including automotive, aerospace, industrial automation, medical, and consumer electronics. The chip model is also designed to be used in a variety of applications, including image processing, automotive safety, and industrial automation.
To ensure the best results, it is important to understand the specific requirements of the application and the design of the chip model. This includes understanding the data flow, the timing requirements, and the power requirements. It is also important to understand the specific design requirements of the chip model, such as the clock frequency, the number of logic elements, and the number of I/O pins.
In order to ensure that the chip model is used in the most efficient manner, it is important to evaluate the design for any potential problems or issues. It is also important to consider the design of the chip model in terms of the future development of related industries and technologies. This includes determining if the application environment requires the support of new technologies or if the existing technologies can be used.
The chip model is designed to provide a high-performance solution for a wide range of applications. By understanding the specific requirements of the application and the design of the chip model, users can ensure that they get the most out of the chip model. With the right design and implementation, the chip model can provide a powerful and reliable solution for any application.
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2,210 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $92.2560 | $92.2560 |
10+ | $91.2640 | $912.6400 |
100+ | $86.3040 | $8,630.4000 |
1000+ | $81.3440 | $40,672.0000 |
10000+ | $74.4000 | $74,400.0000 |
The price is for reference only, please refer to the actual quotation! |