AMD Xilinx
XC2S150E-6FGG456C
XC2S150E-6FGG456C ECAD Model
XC2S150E-6FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 265 | |
| Number of Outputs | 265 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | B | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S150E-6FGG456C Datasheet Download
XC2S150E-6FGG456C Overview
The XC2S150E-6FGG456C chip model is a versatile and powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed in a hardware description language (HDL) such as Verilog or VHDL. The chip model is capable of performing complex calculations and operations quickly and accurately, making it an ideal choice for a variety of applications.
The XC2S150E-6FGG456C chip model is an excellent choice for applications that require high-performance processing, such as digital signal processing, embedded processing, and image processing. With its ability to quickly and accurately perform complex calculations and operations, it is a reliable solution for a variety of applications.
As technology continues to evolve and new technologies become available, the XC2S150E-6FGG456C chip model can be upgraded to keep up with the latest industry trends. The chip model is designed to be easily upgraded to accommodate the latest technologies, allowing it to remain a viable solution for a variety of applications.
The XC2S150E-6FGG456C chip model was originally designed with the intention of providing reliable, high-performance processing solutions for a variety of applications. Its versatility and scalability make it a great choice for many applications, including advanced communication systems. With its ability to quickly and accurately perform complex calculations and operations, the XC2S150E-6FGG456C chip model is an ideal choice for applications that require reliable and high-performance processing solutions.
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1,159 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $18.0792 | $18.0792 |
| 10+ | $17.8848 | $178.8480 |
| 100+ | $16.9128 | $1,691.2800 |
| 1000+ | $15.9408 | $7,970.4000 |
| 10000+ | $14.5800 | $14,580.0000 |
| The price is for reference only, please refer to the actual quotation! | ||