AMD Xilinx
XC2S100E-7FG456C
XC2S100E-7FG456C ECAD Model
XC2S100E-7FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | FBGA-456 | |
| ECCN Code | 3A991.D | |
| Part Package Code | BGA | |
| Pin Count | 456 |
XC2S100E-7FG456C Datasheet Download
XC2S100E-7FG456C Overview
The XC2S100E-7FG456C chip model is a reliable and cost-effective system-on-chip (SoC) solution for a variety of applications. It is designed to provide a high degree of flexibility and performance in a small form factor. This chip model is suitable for a wide range of applications, including embedded systems, industrial control, automotive, and communications.
The XC2S100E-7FG456C chip model offers several advantages. It is built on a scalable architecture that can be tailored to meet specific requirements. It is also designed to provide a high degree of performance and power efficiency. The chip model is equipped with a variety of features, including a dual-core processor, a high-speed memory controller, and a wide range of peripheral interfaces. It also supports a variety of operating systems and development tools.
The XC2S100E-7FG456C chip model is expected to be in high demand in the future. It is a versatile solution that can be used in a variety of industries. It is suitable for applications that require a high degree of performance and power efficiency. The chip model is also expected to be used in advanced communication systems due to its scalability and flexibility.
The design of the XC2S100E-7FG456C chip model is based on a scalable architecture that can be tailored to meet specific requirements. It is equipped with a dual-core processor, a high-speed memory controller, and a wide range of peripheral interfaces. It also supports a variety of operating systems and development tools. The chip model is designed to provide a high degree of performance and power efficiency.
The XC2S100E-7FG456C chip model has been used in a number of case studies. For example, it has been used in a medical device to provide a reliable and cost-effective solution. It has also been used in an industrial control system to provide a high degree of flexibility and performance.
When using the XC2S100E-7FG456C chip model, it is important to consider the specific design requirements and the potential for future upgrades. It is also important to consider the potential for compatibility with advanced communication systems. It is important to ensure that the chip model is able to meet the specific requirements of the application.
In conclusion, the XC2S100E-7FG456C chip model is a reliable and cost-effective SoC solution for a variety of applications. It is designed to provide a high degree of flexibility and performance in a small form factor. The chip model is expected to be in high demand in the future due to its versatility and scalability. It is important to consider the specific design requirements and the potential for future upgrades when using the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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