AMD Xilinx
XC2S100E-6PQG208I
XC2S100E-6PQG208I ECAD Model
XC2S100E-6PQG208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S100E-6PQG208I Datasheet Download
XC2S100E-6PQG208I Overview
The XC2S100E-6PQG208I chip model has been a popular choice for many applications due to its versatility, reliability, and cost-effectiveness. This model is a Field Programmable Gate Array (FPGA) device that has been designed to be easily reconfigured for different applications. Its design intention is to provide users with the flexibility to quickly adapt to changing requirements.
The XC2S100E-6PQG208I chip model is capable of supporting a wide range of technologies, allowing it to be used in a variety of systems. It is a suitable choice for applications that require high-speed data processing and communication. This chip model can be used in advanced communication systems such as 5G, Wi-Fi 6, and Bluetooth 5.0. It is also suitable for applications in the Internet of Things (IoT) and Artificial Intelligence (AI).
The XC2S100E-6PQG208I chip model has the potential to be used in networks and intelligent scenarios. It is capable of efficiently processing large amounts of data in a timely manner, making it suitable for applications such as facial recognition, autonomous vehicles, and smart homes. It can also be used in the era of fully intelligent systems, as it is capable of quickly adapting to changing requirements.
The XC2S100E-6PQG208I chip model is a reliable and cost-effective choice for many applications. Its versatile design allows it to be used in a wide range of systems, from advanced communication systems to intelligent scenarios. With its ability to quickly adapt to changing requirements, this chip model is capable of supporting the latest technologies and can be used in the era of fully intelligent systems. As the industry trends and technology requirements evolve, the XC2S100E-6PQG208I chip model is well-suited to meet the needs of the future.
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2,239 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $39.0283 | $39.0283 |
| 10+ | $38.6086 | $386.0863 |
| 100+ | $36.5103 | $3,651.0333 |
| 1000+ | $34.4120 | $17,206.0190 |
| 10000+ | $31.4744 | $31,474.4250 |
| The price is for reference only, please refer to the actual quotation! | ||