XC2S100E-6PQ208Q
XC2S100E-6PQ208Q
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rohs

AMD Xilinx

XC2S100E-6PQ208Q


XC2S100E-6PQ208Q
F20-XC2S100E-6PQ208Q
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PLASTIC, QFP-208
PLASTIC, QFP-208

XC2S100E-6PQ208Q ECAD Model


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XC2S100E-6PQ208Q Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 146
Number of Outputs 142
Number of Logic Cells 2700
Number of Equivalent Gates 37000
Number of CLBs 600
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade AUTOMOTIVE
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 37000 GATES
Additional Feature MAXIMUM NO OF GATE 100000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PQFP-G208
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 208
Package Body Material PLASTIC/EPOXY
Package Code FQFP
Package Equivalence Code QFP208,1.2SQ,20
Package Shape SQUARE
Package Style FLATPACK, FINE PITCH
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 28 mm
Length 28 mm
Seated Height-Max 4.1 mm
Ihs Manufacturer XILINX INC
Package Description PLASTIC, QFP-208
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code EAR99

XC2S100E-6PQ208Q Datasheet Download


XC2S100E-6PQ208Q Overview



The chip model XC2S100E-6PQ208Q is a powerful and reliable integrated circuit that has been developed to meet the needs of the ever-evolving technology industry. This chip model is manufactured by Xilinx and is designed to provide users with a wide range of features, including low power consumption and high performance. It is capable of supporting a variety of applications, ranging from embedded systems to high-end computing.


The XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. It is capable of supporting a variety of features, including high-speed data transfer, low latency, and reliable communication.


The XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. It is capable of supporting a variety of features, including high-speed data transfer, low latency, and reliable communication.


In terms of industry trends, the XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. As more and more applications are created that require more advanced technology, the XC2S100E-6PQ208Q chip model is designed to meet the demands of these applications.


The XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. As more and more applications are created that require more advanced technology, the XC2S100E-6PQ208Q chip model is designed to meet the demands of these applications.


In terms of product description and design requirements, the XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. The chip model is designed to be able to support a variety of features, including high-speed data transfer, low latency, and reliable communication. It also has a range of additional features, such as the ability to support multiple operating systems and the ability to be used in a variety of environments.


In terms of actual case studies and precautions, the XC2S100E-6PQ208Q chip model is designed to be used in a wide variety of applications, including network applications and intelligent systems. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications. It is important to note that the chip model should be used in accordance with the manufacturer's instructions and that the user should be aware of the potential risks associated with using the chip model.


In conclusion, the XC2S100E-6PQ208Q chip model is a powerful and reliable integrated circuit that has been developed to meet the needs of the ever-evolving technology industry. This chip model is designed to provide users with a low-power, high-performance solution that is capable of supporting a variety of applications, ranging from embedded systems to high-end computing. The chip model is designed to be able to support a variety of features, including high-speed data transfer, low latency, and reliable communication. Additionally, it is important to note that the chip model should be used in accordance with the manufacturer's instructions and that the user should be aware of the potential risks associated with using the chip model.



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Unit Price: $39.4416
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Pricing (USD)

QTY Unit Price Ext Price
1+ $36.6807 $36.6807
10+ $36.2863 $362.8627
100+ $34.3142 $3,431.4192
1000+ $32.3421 $16,171.0560
10000+ $29.5812 $29,581.2000
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