AMD Xilinx
XC2S100E-6PQ208I
XC2S100E-6PQ208I ECAD Model
XC2S100E-6PQ208I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S100E-6PQ208I Datasheet Download
XC2S100E-6PQ208I Overview
The chip model XC2S100E-6PQ208I is a cutting-edge product in the semiconductor industry, developed by Xilinx Inc. It is a high-performance and low-cost FPGA, and has become increasingly popular in the past few years. This model has a variety of features that make it suitable for a wide range of applications, including high-speed data processing, low-power consumption, and a small size.
The XC2S100E-6PQ208I has a number of advantages that make it attractive for use in various industries. Its low-power consumption and small size make it ideal for applications that require low power and space. Additionally, the chip model is highly reliable and can be used in a variety of environments. It also has a high-speed data processing capability and can be used for high-speed communication systems.
The demand for the XC2S100E-6PQ208I model is expected to increase in the future, as more and more applications require its features. The chip model is particularly suitable for applications in the automotive, medical, and industrial sectors, where its low-power consumption and small size are highly desirable. Additionally, its high-speed data processing capability makes it suitable for use in advanced communication systems.
The original design intention of the XC2S100E-6PQ208I model was to provide a low-cost, high-performance FPGA that could be used in a variety of applications. The chip model was designed to be highly reliable and efficient, and to be able to withstand a wide range of environmental conditions. Additionally, the chip model was designed to be easily upgradable, so that it can be used in the most advanced communication systems.
In order to determine whether the application environment requires the support of new technologies, it is important to consider the specific technologies that are needed. For example, if the application requires high-speed data processing, then the XC2S100E-6PQ208I model may be the best choice. On the other hand, if the application requires low-power consumption, then a different chip model may be more suitable.
Overall, the XC2S100E-6PQ208I model is a highly reliable, low-cost FPGA that is well-suited for a variety of applications. Its low-power consumption and small size make it ideal for applications in the automotive, medical, and industrial sectors. Additionally, its high-speed data processing capability makes it suitable for use in advanced communication systems. As the demand for this chip model increases in the future, it is likely that it will continue to be a popular choice for a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||