AMD Xilinx
XC2S100E-6FGG456C
XC2S100E-6FGG456C ECAD Model
XC2S100E-6FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | B | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LEAD FREE, FBGA-456 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2S100E-6FGG456C Datasheet Download
XC2S100E-6FGG456C Overview
The XC2S100E-6FGG456C chip model is a powerful and versatile model that has been developed to meet the demands of high-performance digital signal processing, embedded processing, and image processing. The model is designed to be used with a Hardware Description Language (HDL) and is capable of providing a wide range of features and capabilities.
The XC2S100E-6FGG456C chip model offers a number of advantages over traditional microcontrollers and processors. It is capable of providing higher levels of performance, with a significantly lower power consumption than traditional microcontrollers. It is also able to support a wide range of communication protocols, allowing for the development of complex systems with a wide range of features.
The XC2S100E-6FGG456C chip model is expected to be in high demand in the future. As the demand for high-performance digital signal processing, embedded processing, and image processing increases, the model is expected to be popular in the markets. Furthermore, the model is expected to be used in the development and popularization of future intelligent robots, due to its advanced capabilities and low power consumption.
In order to use the XC2S100E-6FGG456C chip model effectively, it is important to have a team of experts who are familiar with the model and its capabilities. This includes engineers and developers who are knowledgeable in HDL programming, as well as experts in digital signal processing, embedded processing, and image processing. Furthermore, it is important to have a team of experts who understand the model’s features and capabilities in order to ensure that it is used to its fullest potential.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||