AMD Xilinx
XC2S100E-6FG456I
XC2S100E-6FG456I ECAD Model
XC2S100E-6FG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S100E-6FG456I Datasheet Download
XC2S100E-6FG456I Overview
The XC2S100E-6FG456I chip model is a highly advanced integrated circuit that is designed to provide users with exceptional performance and reliability. It is a very popular choice for a wide range of applications such as networking, communication systems, and intelligent scenarios. This chip model is equipped with a number of features that make it an ideal choice for many applications.
In terms of its design, the XC2S100E-6FG456I chip model is equipped with a number of features that make it an ideal choice for many applications. It is designed with a high-speed, low-power FPGA architecture that is capable of performing a wide range of tasks. This architecture is also designed with a number of features that make it capable of handling a variety of workloads with ease. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications.
The XC2S100E-6FG456I chip model is also designed with a number of features that make it an ideal choice for many applications. It is designed with a high-speed, low-power FPGA architecture that is capable of performing a wide range of tasks. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications. Furthermore, this chip model is designed to be able to support a wide range of communication systems, including the latest 5G networks.
The XC2S100E-6FG456I chip model is a highly advanced integrated circuit that is designed to provide users with exceptional performance and reliability. As such, it is expected to be in high demand in the near future, as more and more applications require the use of advanced integrated circuits. Furthermore, this chip model is designed to be able to support a wide range of communication systems, including the latest 5G networks. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications.
In terms of its design, the XC2S100E-6FG456I chip model is designed with a number of features that make it an ideal choice for many applications. It is designed with a high-speed, low-power FPGA architecture that is capable of performing a wide range of tasks. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications. Furthermore, this chip model is designed to be able to support a wide range of communication systems, including the latest 5G networks.
The XC2S100E-6FG456I chip model is also designed with a number of features that make it an ideal choice for many applications. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications. Furthermore, this chip model is designed to be able to support a wide range of communication systems, including the latest 5G networks. In addition, this chip model is capable of being used in the era of fully intelligent systems, which will be necessary in order to keep up with the ever-changing technological landscape.
Overall, the XC2S100E-6FG456I chip model is a highly advanced integrated circuit that is designed to provide users with exceptional performance and reliability. It is expected to be in high demand in the near future, as more and more applications require the use of advanced integrated circuits. Additionally, this chip model is equipped with an advanced feature set that includes an array of digital signal processing (DSP) capabilities, as well as a number of other features that make it suitable for a wide range of applications. Furthermore, this chip model is designed to be able to support a wide range of communication systems, including the latest 5G networks. In addition, this chip model is capable of being used in the era of fully intelligent systems, which will be necessary in order to keep up with the ever-changing technological landscape.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||