AMD Xilinx
XC2S100E-6FG456C
XC2S100E-6FG456C ECAD Model
XC2S100E-6FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC2S100E-6FG456C Datasheet Download
XC2S100E-6FG456C Overview
The chip model XC2S100E-6FG456C is an advanced integrated circuit (IC) developed by Xilinx, a leading provider of programmable logic solutions. This chip model is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing and other applications. It is designed to be used with the HDL (Hardware Description Language) language, which is used to describe the behavior of digital systems.
The original design intention of the XC2S100E-6FG456C was to provide a powerful yet cost-effective solution for digital signal processing and related applications. It has the capability to process data faster and with greater accuracy than many other chips in the same class. It also has the potential to be upgraded with new features and capabilities, allowing it to remain relevant in the ever-evolving world of digital signal processing.
The XC2S100E-6FG456C is also capable of being used in advanced communication systems. It has the potential to be used in networks, allowing for faster and more secure transmission of data. It can also be used in intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. This chip model can be used in the era of fully intelligent systems, allowing for the development of more sophisticated applications.
Overall, the XC2S100E-6FG456C is a powerful and cost-effective solution for digital signal processing and related applications. It is designed to be used with the HDL language and is capable of being upgraded with new features and capabilities. It can also be used in networks and intelligent scenarios, and is suitable for the era of fully intelligent systems.
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