XC2S100-6FGG456C
XC2S100-6FGG456C
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rohs

AMD Xilinx

XC2S100-6FGG456C


XC2S100-6FGG456C
F20-XC2S100-6FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-456
FBGA-456

XC2S100-6FGG456C ECAD Model


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XC2S100-6FGG456C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Logic Cells 2700
Number of Equivalent Gates 100000
Number of CLBs 600
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 100000 GATES
Clock Frequency-Max 263 MHz
Power Supplies 1.5/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC2S100-6FGG456C Datasheet Download


XC2S100-6FGG456C Overview



The chip model XC2S100-6FGG456C has been a major player in the semiconductor industry for some time now. It has been used in a variety of applications, from automotive and industrial applications to communications and consumer electronics. As the industry continues to evolve, the XC2S100-6FGG456C is being adapted to meet the changing needs of the market.


The XC2S100-6FGG456C is a highly advanced chip model that is designed for high-speed, low-power applications. It is based on a 6-layer FPGA architecture and is capable of supporting a wide range of technologies, including Ethernet, USB, and Wi-Fi. It is also capable of supporting real-time data processing and a variety of other functions.


The XC2S100-6FGG456C is an ideal choice for applications that require high-speed, low-power operations. It is also capable of supporting a wide range of technologies, making it suitable for a variety of applications. This makes it an ideal choice for network applications and intelligent scenarios. In the era of fully intelligent systems, the XC2S100-6FGG456C can be used to develop and popularize future intelligent robots.


In order to use the XC2S100-6FGG456C effectively, technical talents with a deep understanding of the chip model and the associated technologies are required. They should have a strong knowledge of the FPGA architecture, as well as the ability to program and debug the chip model. Additionally, they should also have a good understanding of the various technologies that the chip model supports, such as Ethernet, USB, and Wi-Fi.


In conclusion, the XC2S100-6FGG456C is a highly advanced chip model that is capable of supporting a wide range of technologies. It is an ideal choice for applications that require high-speed, low-power operations, and it is also suitable for network applications and intelligent scenarios. Technical talents with a deep understanding of the chip model and the associated technologies are required in order to use the XC2S100-6FGG456C effectively. As the industry continues to evolve, the XC2S100-6FGG456C is being adapted to meet the changing needs of the market and is likely to be a major player in the semiconductor industry for some time to come.



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Unit Price: $62.5997
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Pricing (USD)

QTY Unit Price Ext Price
1+ $58.2177 $58.2177
10+ $57.5917 $575.9172
100+ $54.4617 $5,446.1739
1000+ $51.3318 $25,665.8770
10000+ $46.9498 $46,949.7750
The price is for reference only, please refer to the actual quotation!

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