XC2S100-5FGG456C
XC2S100-5FGG456C
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rohs

AMD Xilinx

XC2S100-5FGG456C


XC2S100-5FGG456C
F20-XC2S100-5FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-456
FBGA-456

XC2S100-5FGG456C ECAD Model


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XC2S100-5FGG456C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Logic Cells 2700
Number of Equivalent Gates 100000
Number of CLBs 600
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 100000 GATES
Clock Frequency-Max 263 MHz
Power Supplies 1.5/3.3,2.5 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC2S100-5FGG456C Datasheet Download


XC2S100-5FGG456C Overview



Chip model XC2S100-5FGG456C is a highly advanced chip model designed for various industries. It is a powerful and reliable chip model that has been designed to meet the needs of the most demanding applications. It is a low-power, high-performance chip model that can be used in a wide range of applications, from consumer electronics to industrial applications.


The XC2S100-5FGG456C chip model has several advantages that make it a great choice for many industries. It is a low-power, high-performance chip model that provides high-speed data processing and communication. It is also highly reliable and can withstand a wide range of temperatures. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable.


In terms of the expected demand trends for the XC2S100-5FGG456C chip model, it is expected to experience a steady increase in demand in the coming years. This is due to the fact that the chip model is suitable for a wide range of industries, and its scalability makes it an attractive option for many applications. Furthermore, the chip model is highly reliable and can be used in a variety of applications.


The original design intention of the XC2S100-5FGG456C chip model was to provide a low-power, high-performance chip model that could be used in a wide range of applications. The chip model was designed to be highly reliable and capable of handling multiple tasks simultaneously. Furthermore, the chip model was designed to be highly scalable and capable of handling a large number of tasks simultaneously.


In terms of the possibility of future upgrades, the XC2S100-5FGG456C chip model is highly upgradable and can be used in a wide range of applications. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable. It is also highly reliable and can withstand a wide range of temperatures.


The product description and specific design requirements of the XC2S100-5FGG456C chip model include a low-power, high-performance chip model that provides high-speed data processing and communication. It is also highly reliable and can withstand a wide range of temperatures. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable.


In terms of actual case studies and precautions, the XC2S100-5FGG456C chip model has been successfully deployed in a variety of industries, including consumer electronics, industrial applications, and automotive applications. Furthermore, the chip model has been tested for reliability and scalability in various applications. In terms of precautions, the chip model should be used in environments that are free of dust, moisture, and extreme temperatures. Furthermore, the chip model should be handled with care and should not be exposed to high levels of vibration or shock.



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Unit Price: $53.4874
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Pricing (USD)

QTY Unit Price Ext Price
1+ $49.7433 $49.7433
10+ $49.2084 $492.0841
100+ $46.5340 $4,653.4038
1000+ $43.8597 $21,929.8340
10000+ $40.1156 $40,115.5500
The price is for reference only, please refer to the actual quotation!

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