
AMD Xilinx
XC2S100-5FGG456C
XC2S100-5FGG456C ECAD Model
XC2S100-5FGG456C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Logic Cells | 2700 | |
Number of Equivalent Gates | 100000 | |
Number of CLBs | 600 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 600 CLBS, 100000 GATES | |
Clock Frequency-Max | 263 MHz | |
Power Supplies | 1.5/3.3,2.5 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC2S100-5FGG456C Datasheet Download
XC2S100-5FGG456C Overview
Chip model XC2S100-5FGG456C is a highly advanced chip model designed for various industries. It is a powerful and reliable chip model that has been designed to meet the needs of the most demanding applications. It is a low-power, high-performance chip model that can be used in a wide range of applications, from consumer electronics to industrial applications.
The XC2S100-5FGG456C chip model has several advantages that make it a great choice for many industries. It is a low-power, high-performance chip model that provides high-speed data processing and communication. It is also highly reliable and can withstand a wide range of temperatures. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable.
In terms of the expected demand trends for the XC2S100-5FGG456C chip model, it is expected to experience a steady increase in demand in the coming years. This is due to the fact that the chip model is suitable for a wide range of industries, and its scalability makes it an attractive option for many applications. Furthermore, the chip model is highly reliable and can be used in a variety of applications.
The original design intention of the XC2S100-5FGG456C chip model was to provide a low-power, high-performance chip model that could be used in a wide range of applications. The chip model was designed to be highly reliable and capable of handling multiple tasks simultaneously. Furthermore, the chip model was designed to be highly scalable and capable of handling a large number of tasks simultaneously.
In terms of the possibility of future upgrades, the XC2S100-5FGG456C chip model is highly upgradable and can be used in a wide range of applications. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable. It is also highly reliable and can withstand a wide range of temperatures.
The product description and specific design requirements of the XC2S100-5FGG456C chip model include a low-power, high-performance chip model that provides high-speed data processing and communication. It is also highly reliable and can withstand a wide range of temperatures. Furthermore, the chip model is capable of handling a large number of tasks simultaneously and is highly scalable.
In terms of actual case studies and precautions, the XC2S100-5FGG456C chip model has been successfully deployed in a variety of industries, including consumer electronics, industrial applications, and automotive applications. Furthermore, the chip model has been tested for reliability and scalability in various applications. In terms of precautions, the chip model should be used in environments that are free of dust, moisture, and extreme temperatures. Furthermore, the chip model should be handled with care and should not be exposed to high levels of vibration or shock.
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2,565 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $49.7433 | $49.7433 |
10+ | $49.2084 | $492.0841 |
100+ | $46.5340 | $4,653.4038 |
1000+ | $43.8597 | $21,929.8340 |
10000+ | $40.1156 | $40,115.5500 |
The price is for reference only, please refer to the actual quotation! |