AMD Xilinx
XC2C64-7VQG100I
XC2C64-7VQG100I ECAD Model
XC2C64-7VQG100I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 64 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 64 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TFQFP, TQFP100,.63SQ | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C64-7VQG100I Datasheet Download
XC2C64-7VQG100I Overview
The chip model XC2C64-7VQG100I is a highly advanced integrated circuit that has been designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is programmed in a hardware description language (HDL) and is capable of handling complex tasks with ease.
The chip model XC2C64-7VQG100I has been designed to meet the needs of the current industry trends, while also being able to accommodate future developments. It is an ideal choice for those looking for a powerful and reliable chip that can handle a variety of tasks. The chip model also has the capability to be upgraded to suit the needs of more advanced communication systems.
The original design intention of the chip model XC2C64-7VQG100I is to provide a powerful and reliable chip that can handle a variety of tasks. It is designed to be able to handle complex tasks with ease, while also being able to accommodate future developments. This chip model is capable of supporting new technologies, depending on what specific technologies are needed.
The chip model XC2C64-7VQG100I is a great choice for those looking for a powerful and reliable chip that can handle a variety of tasks. It is designed to be able to handle complex tasks with ease, while also being able to accommodate future developments. This chip model is capable of supporting new technologies, depending on what specific technologies are needed. It is an ideal choice for those looking for a powerful and reliable chip that can handle a variety of tasks, while also being able to accommodate future developments.
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3,118 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10.8326 | $10.8326 |
| 10+ | $10.7162 | $107.1616 |
| 100+ | $10.1338 | $1,013.3760 |
| 1000+ | $9.5514 | $4,775.6800 |
| 10000+ | $8.7360 | $8,736.0000 |
| The price is for reference only, please refer to the actual quotation! | ||