AMD Xilinx
XC2C64-7PC44I
XC2C64-7PC44I ECAD Model
XC2C64-7PC44I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 33 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 33 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.5862 mm | |
| Length | 16.5862 mm | |
| Seated Height-Max | 4.572 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C64-7PC44I Datasheet Download
XC2C64-7PC44I Overview
The XC2C64-7PC44I chip model is a high-performance, low-power FPGA chip model, designed for digital signal processing, embedded processing, and image processing. It is suitable for applications such as high-speed data acquisition, real-time monitoring and control, high-speed communication and image processing.
The XC2C64-7PC44I is a powerful FPGA chip model that supports the use of the HDL language. It provides a low-power, high-performance and cost-effective solution for embedded system designers. The chip model is designed with a small footprint and a low power consumption, making it suitable for embedded applications.
The XC2C64-7PC44I has a high-speed transceiver, a high-speed memory controller, and a high-speed DSP core. It also has a large number of configurable logic blocks and a wide range of I/O connections. This makes it ideal for applications such as high-speed data acquisition and image processing.
The XC2C64-7PC44I is also designed with a high-speed memory controller, allowing for faster data access and higher throughput. It also supports a wide range of I/O connections, allowing for easy integration with other systems. The chip model also has a high-speed DSP core, allowing for powerful signal processing.
The XC2C64-7PC44I chip model is expected to be in high demand in the future, as it offers a low-cost, low-power, and high-performance solution for embedded system designers. It is designed to be compatible with a wide range of I/O connections, allowing for easy integration with other systems. The chip model also has a high-speed DSP core, allowing for powerful signal processing.
When designing with the XC2C64-7PC44I chip model, there are a few precautions that should be taken. First, the chip model is designed with a small footprint and a low power consumption, which means that it should not be used in applications that require high power consumption. Second, the chip model should not be used for applications that require high-speed data transfer. Lastly, the chip model should not be used for applications that require large amounts of data.
In conclusion, the XC2C64-7PC44I chip model is a powerful, low-cost, low-power FPGA chip model, designed for digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the future, as it offers a low-cost, low-power, and high-performance solution for embedded system designers. When designing with the chip model, there are a few precautions that should be taken, such as avoiding high power consumption, high-speed data transfer, and large amounts of data.
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