AMD Xilinx
XC2C64-7CPG56I
XC2C64-7CPG56I ECAD Model
XC2C64-7CPG56I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 45 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 45 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2C64-7CPG56I Datasheet Download
XC2C64-7CPG56I Overview
The XC2C64-7CPG56I chip model is a powerful and versatile tool for many applications. It was designed for high-performance digital signal processing, embedded processing, image processing, and other tasks that require the use of HDL language. It is a highly efficient chip that is capable of handling complex tasks and is suitable for a wide range of applications.
The original design intention of the XC2C64-7CPG56I chip model was to provide a flexible and powerful platform for digital signal processing. It was designed to be highly efficient and capable of handling complex tasks. The chip model also has the potential to be upgraded in the future to meet the demands of more advanced communication systems. This chip model is capable of handling high-speed data processing and can be used to develop and popularize future intelligent robots.
In order to effectively use the XC2C64-7CPG56I chip model, technical talents are needed who are familiar with HDL language and have experience in digital signal processing, embedded processing, image processing, and other related fields. The chip model requires a deep understanding of the hardware and software components in order to be used to its fullest potential. Having the right technical skills and knowledge is essential for making the most out of the chip model.
Overall, the XC2C64-7CPG56I chip model is a powerful and versatile tool for many applications. It was designed to provide a flexible and powerful platform for digital signal processing and is suitable for a wide range of applications. With the right technical skills and knowledge, the chip model can be used to develop and popularize future intelligent robots.
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4,212 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $9.9473 | $9.9473 |
| 10+ | $9.8403 | $98.4032 |
| 100+ | $9.3055 | $930.5520 |
| 1000+ | $8.7707 | $4,385.3600 |
| 10000+ | $8.0220 | $8,022.0000 |
| The price is for reference only, please refer to the actual quotation! | ||