AMD Xilinx
XC2C64-7CPG56C
XC2C64-7CPG56C ECAD Model
XC2C64-7CPG56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 45 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 45 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2C64-7CPG56C Datasheet Download
XC2C64-7CPG56C Overview
XC2C64-7CPG56C is a chip model developed by Xilinx, Inc., a leading provider of programmable logic solutions. This model is designed with a wide range of features and advantages, making it an ideal choice for a variety of applications.
The XC2C64-7CPG56C chip model offers several advantages, including low power consumption, high speed operation, and a high degree of flexibility. It has a wide range of applications, from industrial automation to consumer electronics. It also has a wide range of input/output capabilities, which makes it suitable for a variety of applications.
With the increasing demand for more efficient and intelligent solutions, the demand for the XC2C64-7CPG56C chip model is expected to grow in the coming years. This chip model can be used in a variety of networks and intelligent scenarios, such as industrial automation, home automation, smart cities, and others. It can also be used in the era of fully-intelligent systems, as it offers a wide range of features and capabilities.
The XC2C64-7CPG56C chip model can also be applied to the development and popularization of future intelligent robots. This chip model is equipped with features such as low power consumption, high speed operation, and flexible input/output capabilities, which makes it suitable for the development of future robots. It also requires advanced technical skills to use the model effectively.
In conclusion, the XC2C64-7CPG56C chip model offers a wide range of features and advantages, making it an ideal choice for a variety of applications. It is expected to have a high demand in the coming years, as it can be used in a variety of networks and intelligent scenarios. It can also be applied to the development and popularization of future intelligent robots, although it requires advanced technical skills to use the model effectively.
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1,940 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10.3416 | $10.3416 |
| 10+ | $10.2304 | $102.3040 |
| 100+ | $9.6744 | $967.4400 |
| 1000+ | $9.1184 | $4,559.2000 |
| 10000+ | $8.3400 | $8,340.0000 |
| The price is for reference only, please refer to the actual quotation! | ||