AMD Xilinx
XC2C64-7CP56C
XC2C64-7CP56C ECAD Model
XC2C64-7CP56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 7.5 ns | |
| Number of Macro Cells | 64 | |
| Number of I/O Lines | 45 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 45 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C64-7CP56C Datasheet Download
XC2C64-7CP56C Overview
The Xilinx XC2C64-7CP56C chip is a member of the Xilinx Spartan-II family and is a low-cost, high-performance FPGA. It is designed for a wide range of applications, from high-end networking and communications to consumer and automotive applications. The chip model XC2C64-7CP56C has a range of features that make it an attractive choice for a variety of applications.
The XC2C64-7CP56C chip is designed for flexibility and scalability. It is capable of supporting multiple technologies, including Ethernet, USB, and Serial RapidIO. It is also capable of supporting multiple protocols, such as Ethernet, Gigabit Ethernet, and Fibre Channel. It is also capable of supporting a wide array of applications, such as automotive, consumer, and networking.
The chip model XC2C64-7CP56C is designed to be used in a wide range of applications, including automotive, consumer, and networking. It is designed to be used in a variety of environments, including high-end networking and communications, consumer and automotive applications, and fully intelligent systems. It is designed to be used in a variety of scenarios, including intelligent networks, intelligent systems, and intelligent devices.
In terms of future development, the XC2C64-7CP56C chip is designed to be scalable and adaptable to the changing needs of the industry. It is designed to support new technologies and protocols as they become available. It is also designed to be used in a variety of applications, including automotive, consumer, and networking.
In terms of product description, the XC2C64-7CP56C chip is designed to be a low-cost, high-performance FPGA. It is designed for a wide range of applications, from high-end networking and communications to consumer and automotive applications. It is designed to be used in a variety of environments, including high-end networking and communications, consumer and automotive applications, and fully intelligent systems.
In terms of design requirements, the XC2C64-7CP56C chip is designed to be scalable and adaptable to the changing needs of the industry. It is designed to support new technologies and protocols as they become available. It is also designed to be used in a variety of applications, including automotive, consumer, and networking.
In terms of actual case studies, the XC2C64-7CP56C chip has been used in a variety of applications, including automotive, consumer, and networking. It has been used in a variety of environments, including high-end networking and communications, consumer and automotive applications, and fully intelligent systems. It has also been used in a variety of scenarios, including intelligent networks, intelligent systems, and intelligent devices.
In terms of precautions, the XC2C64-7CP56C chip is designed to be used in a variety of applications and environments. It is important to ensure that the chip is configured correctly for the application and environment it is being used in. It is also important to ensure that the chip is properly protected from any potential damage or interference.
In conclusion, the XC2C64-7CP56C chip is a low-cost, high-performance FPGA designed for a wide range of applications. It is designed to be used in a variety of environments, including high-end networking and communications, consumer and automotive applications, and fully intelligent systems. It is designed to be scalable and adaptable to the changing needs of the industry, and it is important to ensure that the chip is configured correctly for the application and environment it is being used in.
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