
AMD Xilinx
XC2C64-4VQ100C
XC2C64-4VQ100C ECAD Model
XC2C64-4VQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 4 ns | |
Number of Macro Cells | 64 | |
Number of I/O Lines | 64 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 64 I/O | |
Additional Feature | FAST ZERO POWER DESIGN TECHNOLOGY | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.63SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TFQFP, TQFP100,.63SQ | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2C64-4VQ100C Datasheet Download
XC2C64-4VQ100C Overview
The chip model XC2C64-4VQ100C is a low-cost, high-performance, low-power FPGA from Xilinx. It is suitable for a wide range of applications, including industrial, automotive, and consumer electronics. This chip model is designed to provide a high level of flexibility and scalability, allowing it to be used in various types of applications.
The chip model XC2C64-4VQ100C is designed to support a wide range of technologies, including embedded processors, memory controllers, peripherals, and networking. It also supports advanced communication systems, such as Ethernet, USB, and CAN bus. It is also capable of supporting new technologies, such as Wi-Fi and Bluetooth, as well as emerging technologies, such as ZigBee and Z-Wave.
The design of the chip model XC2C64-4VQ100C is based on a scalable architecture that allows for easy customization and flexibility. It is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical applications. It also supports high-speed data transmission, allowing it to be used in advanced communication systems.
The product description of the chip model XC2C64-4VQ100C provides detailed information about the features and specifications of the chip. This includes the number of logic cells, the number of pins, the I/O voltage, the operating temperature range, the power consumption, and the package size. It also provides information about the number of I/O pins, the number of RAM blocks, and the number of DSP slices.
The chip model XC2C64-4VQ100C has been used in a variety of applications, such as automotive, consumer electronics, industrial, and medical applications. It has been used in projects ranging from the development of automotive infotainment systems to the design of medical devices. It has also been used in the development of industrial automation systems and in the development of consumer electronics products.
When considering the application of the chip model XC2C64-4VQ100C, it is important to consider the specific design requirements of the application. It is also important to consider the possibility of future upgrades, as well as the need for new technologies, such as Wi-Fi and Bluetooth. The design of the chip model should also be considered in terms of the power consumption, the operating temperature range, and the size of the package.
In conclusion, the chip model XC2C64-4VQ100C is a low-cost, high-performance, low-power FPGA from Xilinx. It is designed to provide a high level of flexibility and scalability, allowing it to be used in a wide range of applications. It is also capable of supporting new technologies, as well as emerging technologies, such as ZigBee and Z-Wave. When considering the application of the chip model, it is important to consider the specific design requirements of the application, as well as the possibility of future upgrades and the need for new technologies.
You May Also Be Interested In
3,276 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4.7318 | $4.7318 |
10+ | $4.6810 | $46.8096 |
100+ | $4.4266 | $442.6560 |
1000+ | $4.1722 | $2,086.0800 |
10000+ | $3.8160 | $3,816.0000 |
The price is for reference only, please refer to the actual quotation! |