XC2C64-4VQ100C
XC2C64-4VQ100C
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rohs

AMD Xilinx

XC2C64-4VQ100C


XC2C64-4VQ100C
F20-XC2C64-4VQ100C
Active
FLASH PLD, 4 ns, 64-Cell, CMOS, TFQFP, TQFP100,.63SQ
TFQFP, TQFP100,.63SQ

XC2C64-4VQ100C ECAD Model


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XC2C64-4VQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 4 ns
Number of Macro Cells 64
Number of I/O Lines 64
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 64 I/O
Additional Feature FAST ZERO POWER DESIGN TECHNOLOGY
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description TFQFP, TQFP100,.63SQ
Pin Count 100
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2C64-4VQ100C Datasheet Download


XC2C64-4VQ100C Overview



The chip model XC2C64-4VQ100C is a low-cost, high-performance, low-power FPGA from Xilinx. It is suitable for a wide range of applications, including industrial, automotive, and consumer electronics. This chip model is designed to provide a high level of flexibility and scalability, allowing it to be used in various types of applications.


The chip model XC2C64-4VQ100C is designed to support a wide range of technologies, including embedded processors, memory controllers, peripherals, and networking. It also supports advanced communication systems, such as Ethernet, USB, and CAN bus. It is also capable of supporting new technologies, such as Wi-Fi and Bluetooth, as well as emerging technologies, such as ZigBee and Z-Wave.


The design of the chip model XC2C64-4VQ100C is based on a scalable architecture that allows for easy customization and flexibility. It is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical applications. It also supports high-speed data transmission, allowing it to be used in advanced communication systems.


The product description of the chip model XC2C64-4VQ100C provides detailed information about the features and specifications of the chip. This includes the number of logic cells, the number of pins, the I/O voltage, the operating temperature range, the power consumption, and the package size. It also provides information about the number of I/O pins, the number of RAM blocks, and the number of DSP slices.


The chip model XC2C64-4VQ100C has been used in a variety of applications, such as automotive, consumer electronics, industrial, and medical applications. It has been used in projects ranging from the development of automotive infotainment systems to the design of medical devices. It has also been used in the development of industrial automation systems and in the development of consumer electronics products.


When considering the application of the chip model XC2C64-4VQ100C, it is important to consider the specific design requirements of the application. It is also important to consider the possibility of future upgrades, as well as the need for new technologies, such as Wi-Fi and Bluetooth. The design of the chip model should also be considered in terms of the power consumption, the operating temperature range, and the size of the package.


In conclusion, the chip model XC2C64-4VQ100C is a low-cost, high-performance, low-power FPGA from Xilinx. It is designed to provide a high level of flexibility and scalability, allowing it to be used in a wide range of applications. It is also capable of supporting new technologies, as well as emerging technologies, such as ZigBee and Z-Wave. When considering the application of the chip model, it is important to consider the specific design requirements of the application, as well as the possibility of future upgrades and the need for new technologies.



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QTY Unit Price Ext Price
1+ $4.7318 $4.7318
10+ $4.6810 $46.8096
100+ $4.4266 $442.6560
1000+ $4.1722 $2,086.0800
10000+ $3.8160 $3,816.0000
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