XC2C64-4CP56C
XC2C64-4CP56C
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rohs

AMD Xilinx

XC2C64-4CP56C

XC2C64-4CP56C
AMD Xilinx
F20-XC2C64-4CP56C
Active
FLASH PLD, 4 ns, 64-Cell, CMOS, 6 X 6 MM, 0.50 MM PITCH, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56
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XC2C64-4CP56C Datasheet (PDF)
XC2C64-4CP56C Document (PDF)

XC2C64-4CP56C ECAD Model

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XC2C64-4CP56C Attributes

Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 4 ns
Number of Macro Cells 64
Number of I/O Lines 45
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 45 I/O
Additional Feature FAST ZERO POWER DESIGN TECHNOLOGY
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 56
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 6 mm
Length 6 mm
Seated Height-Max 1.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2C64-4CP56C Datasheet Download

XC2C64-4CP56C Overview


The chip model XC2C64-4CP56C is an important component of many industries today, and its future development will be crucial to the success of these industries. This chip model is a low-power, high-performance integrated circuit that is used in a variety of applications, from consumer electronics to industrial equipment. It is designed to be flexible and reliable, with the ability to be reconfigured for different applications.


The chip model XC2C64-4CP56C is currently being used in a variety of industries, including automotive, medical, industrial, and consumer electronics. Its use in these industries is growing, as it provides a reliable and cost-effective solution for a variety of tasks. In the automotive industry, for example, the chip model is used to control vehicle systems, such as the engine, transmission, and brakes. In the medical industry, it is used to monitor vital signs and provide feedback to medical professionals. In the industrial sector, it is used to control machinery and equipment.


The chip model XC2C64-4CP56C is also well-suited for use in networks and intelligent scenarios. It can be used to control and monitor different devices and systems, as well as to provide real-time data and feedback. This makes it ideal for use in the Internet of Things (IoT) and other intelligent systems. In the future, it is likely that the chip model will be used in fully intelligent systems, as its capabilities can be easily adapted and extended.


When designing a system that uses the chip model XC2C64-4CP56C, it is important to consider the product description, design requirements, and actual case studies. The product description should include details about the chip’s features, such as its power consumption, performance, and compatibility with other components. The design requirements should include the specific tasks the chip model is expected to perform, as well as any additional features that may be needed. Finally, actual case studies should be consulted to ensure that the chip model is suitable for the intended application.


In conclusion, the chip model XC2C64-4CP56C is an important component for many industries today, and its future development will be crucial for the success of these industries. It is well-suited for use in networks and intelligent scenarios, and its capabilities can be adapted and extended for use in fully intelligent systems. When designing a system that uses the chip model, it is important to consider the product description, design requirements, and actual case studies.



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