AMD Xilinx
XC2C384-6TQG144C
XC2C384-6TQG144C ECAD Model
XC2C384-6TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Macro Cells | 384 | |
| Number of I/O Lines | 118 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 118 I/O | |
| Additional Feature | YES | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2C384-6TQG144C Datasheet Download
XC2C384-6TQG144C Overview
The chip model XC2C384-6TQG144C is a cutting-edge integrated circuit manufactured by Xilinx Inc, a leader in programmable logic solutions. It is a high-performance, low-power FPGA (Field Programmable Gate Array) device that is designed to meet the challenges of today’s embedded systems. This chip model is equipped with an array of advanced features, such as a large number of logic cells, distributed RAM, and dedicated multipliers, which make it suitable for a variety of applications.
The industry trends of the chip model XC2C384-6TQG144C are constantly changing due to the rapid development of technology. As the demand for more advanced features increases, the chip model is being upgraded and improved to meet the requirements of the current market. It is also possible that the chip model may be upgraded in the future to support new technologies, depending on the specific requirements of the application environment.
The original design intention of the chip model XC2C384-6TQG144C is to provide a cost-effective and high-performance solution to embedded systems. It is capable of supporting a wide range of applications, from basic data processing to more advanced communication systems. The chip model is also suitable for the development and popularization of future intelligent robots, as it is capable of providing the necessary processing power and features required by these systems.
In order to use the chip model XC2C384-6TQG144C effectively, it is important to have the right technical knowledge and skills. Those who are familiar with the FPGA architecture and programming language can easily configure and program the chip model for their specific applications. Additionally, those who have knowledge of digital signal processing and embedded systems can use the chip model to its full potential.
In conclusion, the chip model XC2C384-6TQG144C is a powerful and versatile integrated circuit that can be used for a variety of applications. It is constantly being upgraded and improved to meet the changing demands of the industry, and can be used for the development and popularization of future intelligent robots. Those who have the right technical knowledge and skills can use the chip model to its full potential.
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