XC2C32-6CPG56I
XC2C32-6CPG56I
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AMD Xilinx

XC2C32-6CPG56I

XC2C32-6CPG56I
AMD Xilinx
F20-XC2C32-6CPG56I
Active
FLASH PLD, 6 ns, 32-Cell, CMOS, 6 X 6 MM, 0.50 MM PITCH, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56
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XC2C32-6CPG56I Datasheet (PDF)
XC2C32-6CPG56I Document (PDF)

XC2C32-6CPG56I ECAD Model

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XC2C32-6CPG56I Attributes

Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 6 ns
Number of Dedicated Inputs 1
Number of Macro Cells 32
Number of I/O Lines 33
Programmable Logic Type FLASH PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 1 DEDICATED INPUTS, 33 I/O
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 56
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 6 mm
Length 6 mm
Seated Height-Max 1.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC2C32-6CPG56I Datasheet Download

XC2C32-6CPG56I Overview


The chip model XC2C32-6CPG56I is a powerful and versatile device that has been gaining popularity in the industry due to its ability to handle high-performance digital signal processing, embedded processing, and image processing. It is capable of supporting a wide range of applications and is particularly useful in the development of intelligent robots. The device requires the use of HDL language, which is a powerful and versatile language for programming digital systems.


The industry trends of the chip model XC2C32-6CPG56I and the future development of related industries will depend on the specific technologies needed to support the application environment. As technology advances, the chip model XC2C32-6CPG56I will continue to be a powerful and versatile device capable of handling a wide range of applications. The device can be used in the development and popularization of future intelligent robots and other advanced applications.


In order to use the chip model XC2C32-6CPG56I effectively, technical talents are required. Knowledge of HDL language is essential for programming digital systems and for developing applications with the chip model XC2C32-6CPG56I. Additionally, knowledge of the specific technologies needed to support the application environment is also necessary.


Overall, the chip model XC2C32-6CPG56I is a powerful and versatile device that is capable of handling a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and the development and popularization of future intelligent robots. Technical talents are needed to use the device effectively, and knowledge of HDL language and the specific technologies needed to support the application environment are essential. The industry trends of the chip model XC2C32-6CPG56I and the future development of related industries will depend on the specific technologies needed.



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QTY Unit Price Ext Price
1+ $5.7660 $5.7660
10+ $5.7040 $57.0400
100+ $5.3940 $539.4000
1000+ $5.0840 $2,542.0000
10000+ $4.6500 $4,650.0000
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Parts Index

XC2C32-6CPG56
2
XC2C32-6CPG
2
XC2C32-6
17
XC2C32-
38
XC2C32
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XC2
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