AMD Xilinx
XC2C32-6CPG56C
XC2C32-6CPG56C ECAD Model
XC2C32-6CPG56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Dedicated Inputs | 1 | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 33 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1 DEDICATED INPUTS, 33 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2C32-6CPG56C Datasheet Download
XC2C32-6CPG56C Overview
The Xilinx XC2C32-6CPG56C chip model is a powerful and versatile integrated circuit (IC) that has been designed to meet the needs of a wide range of applications. Its original design intention was to provide a comprehensive solution for a variety of complex tasks, including digital signal processing (DSP), communications, and embedded systems. With its advanced features and capabilities, the XC2C32-6CPG56C chip model is capable of meeting the demands of today's most advanced communication systems.
The XC2C32-6CPG56C chip model is a field programmable gate array (FPGA) that contains 32 I/O pins and 6,000 logic cells. It offers a variety of features, such as high-speed data transfer, memory interface, and on-chip debugging. The chip model also contains an array of configurable logic blocks that can be used to implement complex logic functions. Additionally, the XC2C32-6CPG56C chip model is capable of being upgraded with the latest technology for future applications.
The XC2C32-6CPG56C chip model is suitable for use in a wide variety of applications, including digital signal processing, communications, and embedded systems. It can also be used in the development and popularization of future intelligent robots. In order to make the most of the XC2C32-6CPG56C chip model, it is important to understand its features and capabilities, as well as its design requirements.
Case studies of the XC2C32-6CPG56C chip model can provide valuable insight into its features and capabilities. Additionally, it is important to be aware of any potential risks associated with the chip model, such as power supply issues and temperature sensitivity. By understanding these risks and taking the necessary precautions, users can ensure that they are using the XC2C32-6CPG56C chip model safely and effectively.
In order to effectively use the XC2C32-6CPG56C chip model, technical talent is required. This includes knowledge of digital signal processing, communications, and embedded systems. Additionally, understanding the features and capabilities of the chip model, as well as its design requirements, is essential.
The Xilinx XC2C32-6CPG56C chip model is a powerful and versatile integrated circuit that is suitable for a variety of applications. Its original design intention was to provide a comprehensive solution for complex tasks, and it is capable of being upgraded with the latest technology for future applications. It can also be used in the development and popularization of future intelligent robots. In order to make the most of the XC2C32-6CPG56C chip model, it is important to understand its features and capabilities, as well as its design requirements, and to take the necessary precautions. Technical talent is also required in order to effectively use the XC2C32-6CPG56C chip model.
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5,919 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5.7660 | $5.7660 |
| 10+ | $5.7040 | $57.0400 |
| 100+ | $5.3940 | $539.4000 |
| 1000+ | $5.0840 | $2,542.0000 |
| 10000+ | $4.6500 | $4,650.0000 |
| The price is for reference only, please refer to the actual quotation! | ||