XC2C32-6CP56I
XC2C32-6CP56I
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rohs

AMD Xilinx

XC2C32-6CP56I


XC2C32-6CP56I
F20-XC2C32-6CP56I
Active
FLASH PLD, 6 ns, 32-Cell, CMOS, 6 X 6 MM, 0.50 MM PITCH, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56

XC2C32-6CP56I ECAD Model


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XC2C32-6CP56I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 6 ns
Number of Dedicated Inputs 1
Number of Macro Cells 32
Number of I/O Lines 33
Programmable Logic Type FLASH PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 1 DEDICATED INPUTS, 33 I/O
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 56
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 6 mm
Length 6 mm
Seated Height-Max 1.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2C32-6CP56I Datasheet Download


XC2C32-6CP56I Overview



The XC2C32-6CP56I chip model is a highly advanced integrated circuit (IC) that has been developed to meet the demands of modern communication systems. It is a low-power, low-cost, and high-performance device that can be used in a variety of applications. It is designed to provide a high level of performance, while also being extremely energy efficient and cost-effective.


The XC2C32-6CP56I chip model is designed to be used in a variety of communication systems, including cellular, Wi-Fi, Bluetooth, and other wireless technologies. It is designed to handle a wide range of data rates, and is designed to be compatible with a variety of communication protocols. It is also capable of supporting a variety of encryption algorithms, making it suitable for secure communication applications.


The XC2C32-6CP56I chip model is designed to be highly scalable and upgradable. It is capable of being used in a variety of applications, including those that require high-speed data transfer, and those that require low-power operation. It is also designed to be easily integrated into existing systems, and can be used in a variety of applications without the need for major modifications.


The XC2C32-6CP56I chip model is also designed to be used in a variety of intelligent scenarios. It can be used in networks for data transfer, as well as for intelligent control systems. It is also capable of being used in the era of fully intelligent systems, with its ability to support a variety of algorithms and protocols. This makes it suitable for a variety of applications, including those that require advanced communication systems.


The XC2C32-6CP56I chip model is expected to be in high demand in the future, due to its low cost and high performance. Its scalability and upgradability also make it a suitable choice for a variety of applications, and its ability to support a variety of protocols and algorithms make it suitable for a variety of intelligent scenarios. As the demand for advanced communication systems increases, the XC2C32-6CP56I chip model is expected to become increasingly popular.



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Unit Price: $1.056
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Pricing (USD)

QTY Unit Price Ext Price
1+ $0.9821 $0.9821
10+ $0.9715 $9.7152
100+ $0.9187 $91.8720
1000+ $0.8659 $432.9600
10000+ $0.7920 $792.0000
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