XC2C32-6CP56C
XC2C32-6CP56C
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rohs

AMD Xilinx

XC2C32-6CP56C


XC2C32-6CP56C
F20-XC2C32-6CP56C
Active
FLASH PLD, 6 ns, 32-Cell, CMOS, 6 X 6 MM, 0.50 MM PITCH, CSP-56
6 X 6 MM, 0.50 MM PITCH, CSP-56

XC2C32-6CP56C ECAD Model


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XC2C32-6CP56C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 6 ns
Number of Dedicated Inputs 1
Number of Macro Cells 32
Number of I/O Lines 33
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 1 DEDICATED INPUTS, 33 I/O
Additional Feature REAL DIGITAL DESIGN TECHNOLOGY
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B56
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 56
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA56,10X10,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 6 mm
Length 6 mm
Seated Height-Max 1.35 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 6 X 6 MM, 0.50 MM PITCH, CSP-56
Pin Count 56
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2C32-6CP56C Datasheet Download


XC2C32-6CP56C Overview



The XC2C32-6CP56C chip model is a cutting-edge technology developed by Xilinx Corporation, a world-leading provider of programmable logic devices. It is a highly integrated, low-cost, low-power, high-performance FPGA that is designed for the most demanding embedded applications. The chip model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption.


The XC2C32-6CP56C chip model is a perfect choice for embedded applications that require high performance and low power consumption. The model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption. It is also designed to be used in a variety of applications, including automotive, consumer electronics, industrial automation, medical, and aerospace.


The XC2C32-6CP56C chip model is ideal for applications that require high-speed data processing, high-performance computing, and low-power consumption. It is also designed to be used in a variety of applications, including automotive, consumer electronics, industrial automation, medical, and aerospace. The model is expected to be in high demand in the future, as the demand for high-performance, low-power devices increases.


The XC2C32-6CP56C chip model is also expected to be an ideal choice for the development and popularization of future intelligent robots. The model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption. To effectively use the model, technical talents such as software engineers, electrical engineers, and robotics specialists are needed.


In conclusion, the XC2C32-6CP56C chip model is a cutting-edge technology developed by Xilinx Corporation, a world-leading provider of programmable logic devices. It is a highly integrated, low-cost, low-power, high-performance FPGA that is designed for the most demanding embedded applications. The model is expected to be in high demand in the future, as the demand for high-performance, low-power devices increases. It is also expected to be an ideal choice for the development and popularization of future intelligent robots. To effectively use the model, technical talents such as software engineers, electrical engineers, and robotics specialists are needed.



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