
AMD Xilinx
XC2C32-6CP56C
XC2C32-6CP56C ECAD Model
XC2C32-6CP56C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 6 ns | |
Number of Dedicated Inputs | 1 | |
Number of Macro Cells | 32 | |
Number of I/O Lines | 33 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1 DEDICATED INPUTS, 33 I/O | |
Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B56 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 56 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA56,10X10,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 500 µm | |
Terminal Position | BOTTOM | |
Width | 6 mm | |
Length | 6 mm | |
Seated Height-Max | 1.35 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
Pin Count | 56 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2C32-6CP56C Datasheet Download
XC2C32-6CP56C Overview
The XC2C32-6CP56C chip model is a cutting-edge technology developed by Xilinx Corporation, a world-leading provider of programmable logic devices. It is a highly integrated, low-cost, low-power, high-performance FPGA that is designed for the most demanding embedded applications. The chip model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption.
The XC2C32-6CP56C chip model is a perfect choice for embedded applications that require high performance and low power consumption. The model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption. It is also designed to be used in a variety of applications, including automotive, consumer electronics, industrial automation, medical, and aerospace.
The XC2C32-6CP56C chip model is ideal for applications that require high-speed data processing, high-performance computing, and low-power consumption. It is also designed to be used in a variety of applications, including automotive, consumer electronics, industrial automation, medical, and aerospace. The model is expected to be in high demand in the future, as the demand for high-performance, low-power devices increases.
The XC2C32-6CP56C chip model is also expected to be an ideal choice for the development and popularization of future intelligent robots. The model is designed to provide a cost-effective solution for applications that require high-speed data processing, high-performance computing, and low-power consumption. To effectively use the model, technical talents such as software engineers, electrical engineers, and robotics specialists are needed.
In conclusion, the XC2C32-6CP56C chip model is a cutting-edge technology developed by Xilinx Corporation, a world-leading provider of programmable logic devices. It is a highly integrated, low-cost, low-power, high-performance FPGA that is designed for the most demanding embedded applications. The model is expected to be in high demand in the future, as the demand for high-performance, low-power devices increases. It is also expected to be an ideal choice for the development and popularization of future intelligent robots. To effectively use the model, technical talents such as software engineers, electrical engineers, and robotics specialists are needed.
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