AMD Xilinx
XC2C32-4VQ44C
XC2C32-4VQ44C ECAD Model
XC2C32-4VQ44C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 4 ns | |
| Number of Dedicated Inputs | 1 | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 33 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1 DEDICATED INPUTS, 33 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PQFP-G44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TQFP | |
| Package Equivalence Code | TQFP44,.47SQ,32 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 800 µm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| Length | 10 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | TQFP, TQFP44,.47SQ,32 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C32-4VQ44C Datasheet Download
XC2C32-4VQ44C Overview
The XC2C32-4VQ44C chip model is a powerful and versatile model that is well suited for a variety of applications. It is particularly useful for high-performance digital signal processing, embedded processing, and image processing. This chip model requires the use of HDL language, which is a language specifically designed for hardware design.
The XC2C32-4VQ44C chip model has many advantages. It is capable of performing complex calculations quickly and accurately. It is also highly reliable, with a low failure rate. Additionally, this chip model is highly energy efficient, making it an ideal choice for applications that require minimal power consumption.
The XC2C32-4VQ44C chip model is expected to be in high demand in the future. This is due to the increasing demand for digital signal processing, embedded processing, and image processing. As these applications become more complex, the need for powerful and reliable chips will increase. The XC2C32-4VQ44C chip model is well-suited to meet these demands.
The application environment of the XC2C32-4VQ44C chip model may require the support of new technologies. This will depend on the specific technologies needed for the application. For example, if the application requires the use of artificial intelligence, then the chip model may need to be equipped with AI-specific hardware and software.
The XC2C32-4VQ44C chip model is expected to be in high demand in the future, as it offers a powerful and reliable solution for a variety of applications. It is expected to be adopted by a wide range of industries, from consumer electronics to industrial automation. As the demand for digital signal processing, embedded processing, and image processing increases, the XC2C32-4VQ44C chip model is expected to remain a popular choice.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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