AMD Xilinx
XC2C32-3CPG56C
XC2C32-3CPG56C ECAD Model
XC2C32-3CPG56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 3 ns | |
| Number of Dedicated Inputs | 1 | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 33 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1 DEDICATED INPUTS, 33 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2C32-3CPG56C Datasheet Download
XC2C32-3CPG56C Overview
The XC2C32-3CPG56C chip model is a powerful and versatile processor that can be used in a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is programmed with a Hardware Description Language (HDL), which is a type of language used to describe the behavior of hardware components.
The XC2C32-3CPG56C chip model is an important component of the rapidly growing field of intelligent systems. It is a powerful processor that can be used in a variety of applications, from high-performance digital signal processing, to embedded processing, and image processing. The chip is capable of handling complex tasks, such as facial recognition, object tracking, and natural language processing.
The XC2C32-3CPG56C chip model is well-suited for use in networks, as it is capable of handling large amounts of data quickly and efficiently. It can be used to enable intelligent systems, such as autonomous vehicles, smart homes, and industrial automation. It can also be used in the era of fully intelligent systems, where machines can learn and adapt to their environment.
The XC2C32-3CPG56C chip model is a powerful tool that can be used to create intelligent systems. It is capable of handling complex tasks and is well-suited for use in networks. As the field of intelligent systems continues to grow, the XC2C32-3CPG56C chip model will continue to be an important component. With the application of new technologies, the chip model will be able to handle increasingly complex tasks, and will be an integral part of the future of intelligent systems.
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|---|---|---|
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