AMD Xilinx
XC2C32-3CP56C
XC2C32-3CP56C ECAD Model
XC2C32-3CP56C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 3 ns | |
| Number of Dedicated Inputs | 1 | |
| Number of Macro Cells | 32 | |
| Number of I/O Lines | 33 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1 DEDICATED INPUTS, 33 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B56 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 56 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA56,10X10,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm | |
| Length | 6 mm | |
| Seated Height-Max | 1.35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | |
| Pin Count | 56 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2C32-3CP56C Datasheet Download
XC2C32-3CP56C Overview
The XC2C32-3CP56C chip model is a powerful and versatile tool that can be used in a variety of applications. It is designed to provide high performance digital signal processing, embedded processing, and image processing capabilities. It is also capable of supporting the use of HDL language, which allows for more complex programming and greater flexibility.
The original design intention of the XC2C32-3CP56C was to provide a high-performance and reliable platform for a range of applications. It is also designed to be upgradeable, allowing for improvements and new features to be added over time. This makes it ideal for advanced communication systems, as well as for the development of future applications.
The XC2C32-3CP56C is also capable of being used in network applications, such as the Internet of Things. It is also well suited for use in intelligent scenarios, such as machine learning and artificial intelligence. With its powerful capabilities and upgradeable design, the XC2C32-3CP56C is a great choice for the development of fully intelligent systems.
In conclusion, the XC2C32-3CP56C chip model is an excellent choice for a variety of applications, from digital signal processing to embedded processing to image processing. It is also well suited for use in network applications and intelligent scenarios. With its powerful capabilities and upgradeable design, the XC2C32-3CP56C is an ideal choice for the development of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||