
AMD Xilinx
XC2018-70PC84C
XC2018-70PC84C ECAD Model
XC2018-70PC84C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 74 | |
Number of Outputs | 74 | |
Number of Logic Cells | 100 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 10 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 1000 GATES | |
Additional Feature | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | |
Clock Frequency-Max | 70 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-PQCC-J84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 84 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.3116 mm | |
Length | 29.3116 mm | |
Seated Height-Max | 5.08 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | QCCJ, LDCC84,1.2SQ | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC2018-70PC84C Datasheet Download
XC2018-70PC84C Overview
The XC2018-70PC84C chip model is a powerful and reliable addition to the modern technological landscape. Developed by experts in the field of communication systems, this chip model is designed to meet the needs of advanced communication systems. It provides a wide range of features, including high-speed data transmission, low power consumption, and excellent compatibility.
The XC2018-70PC84C chip model was designed with the intention of providing users with a reliable and efficient solution for their communication needs. With its versatile design and powerful features, this chip model is ideal for use in advanced communication systems. It has been designed to provide users with a reliable, high-speed connection, while also allowing for low power consumption. Additionally, the chip model is capable of supporting a wide range of communications protocols and is compatible with a variety of hardware and software solutions.
The XC2018-70PC84C chip model is an ideal solution for a wide range of applications. It is capable of supporting the latest technologies and can be used in various intelligent scenarios, such as the Internet of Things (IoT), Artificial Intelligence (AI), and machine learning. Additionally, this chip model is capable of supporting the latest communication standards, such as 5G and Wi-Fi 6. This makes it an ideal solution for the era of fully intelligent systems.
The product description of the XC2018-70PC84C chip model is designed to meet the specific requirements of advanced communication systems. It is designed to provide users with a reliable and efficient solution for their communication needs. It features a low power consumption, high-speed data transmission, and excellent compatibility with a variety of hardware and software solutions. Additionally, the chip model is capable of supporting a wide range of communication protocols, making it an ideal solution for a variety of applications.
In addition to its design features, the XC2018-70PC84C chip model also has the potential to be upgraded in the future. With its versatile design and powerful features, this chip model is capable of being used in a variety of scenarios and can be used in the era of fully intelligent systems. Furthermore, actual case studies have been conducted to ensure that the chip model meets the specific requirements of advanced communication systems.
Overall, the XC2018-70PC84C chip model is an excellent choice for advanced communication systems. It is designed to provide users with a reliable and efficient solution for their communication needs, while also allowing for low power consumption and high-speed data transmission. Additionally, the chip model is capable of supporting a wide range of communication protocols, making it an ideal solution for a variety of applications. Furthermore, the chip model has the potential to be upgraded in the future and can be used in the era of fully intelligent systems.
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4,745 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9.6720 | $9.6720 |
10+ | $9.5680 | $95.6800 |
100+ | $9.0480 | $904.8000 |
1000+ | $8.5280 | $4,264.0000 |
10000+ | $7.8000 | $7,800.0000 |
The price is for reference only, please refer to the actual quotation! |