AMD Xilinx
XC2018-70PC68I
XC2018-70PC68I ECAD Model
XC2018-70PC68I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 58 | |
| Number of Outputs | 58 | |
| Number of Logic Cells | 100 | |
| Number of Equivalent Gates | 1000 | |
| Number of CLBs | 100 | |
| Combinatorial Delay of a CLB-Max | 10 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 100 CLBS, 1000 GATES | |
| Additional Feature | 174 FLIP-FLOPS; TYP. GATES = 1000-1500 | |
| Clock Frequency-Max | 70 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J68 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 68 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC68,1.0SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 24.2316 mm | |
| Length | 24.2316 mm | |
| Seated Height-Max | 4.445 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | QCCJ, LDCC68,1.0SQ | |
| Pin Count | 68 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC2018-70PC68I Datasheet Download
XC2018-70PC68I Overview
The XC2018-70PC68I chip model is an advanced integrated circuit designed to meet the needs of modern electronic systems. It is a highly efficient and reliable chip, with a wide range of applications in the communications industry. The chip model is designed to provide a high level of performance and reliability, while maintaining a low power consumption.
The XC2018-70PC68I chip model has a number of advantages that make it an attractive choice for many applications. It is highly efficient, with a low power consumption rate, and can be used in a variety of applications. The chip model also has a high level of integration, allowing for a wide range of features and capabilities. This makes it an ideal choice for many applications, such as wireless networks, internet of things, and advanced communication systems.
The original design intention of the XC2018-70PC68I chip model was to provide a reliable and efficient solution for modern electronic systems. The chip model has been designed to provide a high level of performance and reliability, while maintaining a low power consumption rate. The chip model has also been designed with the possibility of future upgrades in mind, allowing for the integration of new features and capabilities into the chip model. This makes it an ideal choice for many advanced communication systems.
The XC2018-70PC68I chip model has a number of specific design requirements that must be met in order to ensure its performance and reliability. These requirements include the use of advanced technologies, such as the use of high-speed memory, high-speed processors, and the integration of advanced communication protocols. In addition, the chip model must also be able to support a wide range of applications, including wireless networks, internet of things, and advanced communication systems.
In order to ensure the performance and reliability of the XC2018-70PC68I chip model, it is important to follow certain precautions. This includes ensuring that the chip model is properly installed and configured, as well as ensuring that the chip model is regularly tested and monitored. It is also important to ensure that the chip model is regularly updated, as this will help to ensure that the chip model remains reliable and efficient.
The XC2018-70PC68I chip model has been used in a number of case studies and applications, and these have proven to be successful. The chip model has been used in a variety of communication systems, including wireless networks, internet of things, and advanced communication systems. In addition, the chip model has also been used in a number of consumer electronics products, such as smartphones and tablets.
As the demand for advanced communication systems continues to grow, the XC2018-70PC68I chip model is expected to remain a popular choice for many applications. The chip model is highly efficient and reliable, and can be used in a variety of applications. The chip model also has the potential to be upgraded in the future, allowing for the integration of new features and capabilities. This makes it an ideal choice for many advanced communication systems.
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1,971 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $31.2480 | $31.2480 |
| 10+ | $30.9120 | $309.1200 |
| 100+ | $29.2320 | $2,923.2000 |
| 1000+ | $27.5520 | $13,776.0000 |
| 10000+ | $25.2000 | $25,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||