
AMD Xilinx
XC2018-50PG84I
XC2018-50PG84I ECAD Model
XC2018-50PG84I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 74 | |
Number of Outputs | 74 | |
Number of Logic Cells | 100 | |
Number of Equivalent Gates | 1000 | |
Number of CLBs | 100 | |
Combinatorial Delay of a CLB-Max | 15 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 100 CLBS, 1000 GATES | |
Additional Feature | MAX. 74 I/OS; 174 FLIP-FLOPS; TYP. GATES = 1000 - 1500 | |
Clock Frequency-Max | 50 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-CPGA-P84 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 84 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA84M,11X11 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | NO | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 27.94 mm | |
Length | 27.94 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA84M,11X11 | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC2018-50PG84I Datasheet Download
XC2018-50PG84I Overview
The chip model XC2018-50PG84I is a powerful and versatile integrated circuit designed to meet the needs of a wide range of applications. This model is designed to provide a high degree of functionality, flexibility and scalability, and is suitable for various types of embedded systems. It has a wide range of features, including a high-performance processor, advanced memory and peripheral interfaces, and a variety of communication protocols.
The XC2018-50PG84I chip model offers a number of advantages. It is designed to be highly reliable, with a low power consumption and a high degree of flexibility. It is also capable of supporting a wide range of communication protocols, including Bluetooth, Wi-Fi, and Zigbee. Additionally, this model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android.
The XC2018-50PG84I chip model is expected to be in high demand in the future, as it provides an efficient and cost-effective solution for a variety of applications. This model is particularly well suited for use in the development of embedded systems, as it offers a high degree of flexibility and scalability. Additionally, this model is expected to be in high demand in the automotive and consumer electronics industry, as it is designed to be compatible with a variety of operating systems and communication protocols.
The original design intention of the XC2018-50PG84I chip model was to provide a high degree of flexibility and scalability for a wide range of applications. Additionally, this model is designed to be capable of supporting a variety of communication protocols, making it suitable for use in a wide range of applications. This model is also designed to be highly reliable and to provide a low power consumption.
The XC2018-50PG84I chip model is capable of being upgraded in the future to support new features and technologies. This model is also capable of being used in the development and popularization of future intelligent robots, as it is designed to be compatible with a variety of operating systems and communication protocols. To effectively use this model, it is important to have a strong understanding of embedded systems and a good knowledge of communication protocols and operating systems. Additionally, it is important to have the technical skills necessary to program and debug the chip model.
Overall, the XC2018-50PG84I chip model is a powerful and versatile integrated circuit designed to meet the needs of a wide range of applications. This model offers a number of advantages, including a high degree of flexibility and scalability, a low power consumption, and the ability to support a variety of communication protocols. This model is expected to be in high demand in the future, as it provides an efficient and cost-effective solution for a variety of applications. Additionally, this model is capable of being upgraded in the future and can be used in the development and popularization of future intelligent robots. To effectively use this model, it is important to have a strong understanding of embedded systems and a good knowledge of communication protocols and operating systems, as well as the technical skills necessary to program and debug the chip model.
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