XC2018-50PG84I
XC2018-50PG84I
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rohs

AMD Xilinx

XC2018-50PG84I


XC2018-50PG84I
F20-XC2018-50PG84I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, PGA, PGA84M,11X11
PGA, PGA84M,11X11

XC2018-50PG84I ECAD Model


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XC2018-50PG84I Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 74
Number of Outputs 74
Number of Logic Cells 100
Number of Equivalent Gates 1000
Number of CLBs 100
Combinatorial Delay of a CLB-Max 15 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 100 CLBS, 1000 GATES
Additional Feature MAX. 74 I/OS; 174 FLIP-FLOPS; TYP. GATES = 1000 - 1500
Clock Frequency-Max 50 MHz
Power Supplies 5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-CPGA-P84
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Number of Terminals 84
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA84M,11X11
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount NO
Terminal Finish TIN SILVER COPPER
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 27.94 mm
Length 27.94 mm
Seated Height-Max 4.318 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description PGA, PGA84M,11X11
Pin Count 84
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC2018-50PG84I Datasheet Download


XC2018-50PG84I Overview



The chip model XC2018-50PG84I is a powerful and versatile integrated circuit designed to meet the needs of a wide range of applications. This model is designed to provide a high degree of functionality, flexibility and scalability, and is suitable for various types of embedded systems. It has a wide range of features, including a high-performance processor, advanced memory and peripheral interfaces, and a variety of communication protocols.


The XC2018-50PG84I chip model offers a number of advantages. It is designed to be highly reliable, with a low power consumption and a high degree of flexibility. It is also capable of supporting a wide range of communication protocols, including Bluetooth, Wi-Fi, and Zigbee. Additionally, this model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android.


The XC2018-50PG84I chip model is expected to be in high demand in the future, as it provides an efficient and cost-effective solution for a variety of applications. This model is particularly well suited for use in the development of embedded systems, as it offers a high degree of flexibility and scalability. Additionally, this model is expected to be in high demand in the automotive and consumer electronics industry, as it is designed to be compatible with a variety of operating systems and communication protocols.


The original design intention of the XC2018-50PG84I chip model was to provide a high degree of flexibility and scalability for a wide range of applications. Additionally, this model is designed to be capable of supporting a variety of communication protocols, making it suitable for use in a wide range of applications. This model is also designed to be highly reliable and to provide a low power consumption.


The XC2018-50PG84I chip model is capable of being upgraded in the future to support new features and technologies. This model is also capable of being used in the development and popularization of future intelligent robots, as it is designed to be compatible with a variety of operating systems and communication protocols. To effectively use this model, it is important to have a strong understanding of embedded systems and a good knowledge of communication protocols and operating systems. Additionally, it is important to have the technical skills necessary to program and debug the chip model.


Overall, the XC2018-50PG84I chip model is a powerful and versatile integrated circuit designed to meet the needs of a wide range of applications. This model offers a number of advantages, including a high degree of flexibility and scalability, a low power consumption, and the ability to support a variety of communication protocols. This model is expected to be in high demand in the future, as it provides an efficient and cost-effective solution for a variety of applications. Additionally, this model is capable of being upgraded in the future and can be used in the development and popularization of future intelligent robots. To effectively use this model, it is important to have a strong understanding of embedded systems and a good knowledge of communication protocols and operating systems, as well as the technical skills necessary to program and debug the chip model.



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